Part Details for S29GL064N90FFI012 by Cypress Semiconductor
Results Overview of S29GL064N90FFI012 by Cypress Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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S29GL064N90FFI012 Information
S29GL064N90FFI012 by Cypress Semiconductor is a Flash Memory.
Flash Memories are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Part Details for S29GL064N90FFI012
S29GL064N90FFI012 CAD Models
S29GL064N90FFI012 Part Data Attributes
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S29GL064N90FFI012
Cypress Semiconductor
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Datasheet
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S29GL064N90FFI012
Cypress Semiconductor
Flash, 4MX16, 90ns, PBGA64, 13 X 11 MM, LEAD FREE, FBGA-64
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.1.A | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 90 ns | |
| Alternate Memory Width | 8 | |
| Boot Block | BOTTOM/TOP | |
| Command User Interface | YES | |
| Common Flash Interface | YES | |
| Data Polling | YES | |
| JESD-30 Code | R-PBGA-B64 | |
| JESD-609 Code | e1 | |
| Length | 13 mm | |
| Memory Density | 67108864 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 16 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Sectors/Size | 128 | |
| Number of Terminals | 64 | |
| Number of Words | 4194304 words | |
| Number of Words Code | 4000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 4MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA64,8X8,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Page Size | 8/16 words | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programming Voltage | 3 V | |
| Qualification Status | Not Qualified | |
| Ready/Busy | YES | |
| Seated Height-Max | 1.4 mm | |
| Sector Size | 64K | |
| Standby Current-Max | 0.000005 A | |
| Supply Current-Max | 0.05 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Toggle Bit | YES | |
| Type | NOR TYPE | |
| Width | 11 mm |
Alternate Parts for S29GL064N90FFI012
This table gives cross-reference parts and alternative options found for S29GL064N90FFI012. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of S29GL064N90FFI012, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
S29GL064N90FFI012 Frequently Asked Questions (FAQ)
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The maximum operating temperature range for the S29GL064N90FFI012 is -40°C to +85°C.
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The hold signal (HOLD#) should be kept high during active operations. If the hold signal is asserted low, the device will enter a 'hold' state, and all operations will be suspended.
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The write protect (WP#) signal is used to prevent accidental writes to the device. When WP# is low, the device is in a write-protected state, and all write operations are inhibited.
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The S29GL064N90FFI012 is a 64 Mbit flash memory device, organized as 8192 words of 8192 bits each. The device density and organization can be determined by reading the device ID and revision ID registers.
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The recommended power-up sequence is to apply VCC first, followed by VPP (if used), and then the clock signal. This ensures proper device initialization and prevents latch-up conditions.