Part Details for S25FS064SDSBHM023 by Infineon Technologies AG
Results Overview of S25FS064SDSBHM023 by Infineon Technologies AG
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
S25FS064SDSBHM023 Information
S25FS064SDSBHM023 by Infineon Technologies AG is a Flash Memory.
Flash Memories are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for S25FS064SDSBHM023
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
448-S25FS064SDSBHM023TR-ND
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DigiKey | IC FLASH 64MBIT SPI/QUAD 24BGA Min Qty: 2500 Lead time: 10 Weeks Container: Tape & Reel (TR) | Temporarily Out of Stock |
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$1.9014 | Buy Now |
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DISTI #
727-25FS064SDSBHM023
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Mouser Electronics | NOR Flash STD SPI RoHS: Compliant | 0 |
|
$1.9700 | Order Now |
Part Details for S25FS064SDSBHM023
S25FS064SDSBHM023 CAD Models
S25FS064SDSBHM023 Part Data Attributes
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S25FS064SDSBHM023
Infineon Technologies AG
Buy Now
Datasheet
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Compare Parts:
S25FS064SDSBHM023
Infineon Technologies AG
Flash, 8MX8, PBGA24,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Reach Compliance Code | compliant | |
| Clock Frequency-Max (fCLK) | 80 MHz | |
| Data Retention Time-Min | 20 | |
| Endurance | 100000 Write/Erase Cycles | |
| JESD-30 Code | R-PBGA-B24 | |
| Length | 8 mm | |
| Memory Density | 67108864 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 8388608 words | |
| Number of Words Code | 8000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 8MX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TBGA | |
| Package Equivalence Code | BGA24,5X5,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE | |
| Parallel/Serial | SERIAL | |
| Programming Voltage | 1.8 V | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 1.2 mm | |
| Serial Bus Type | QSPI | |
| Standby Current-Max | 0.00017 A | |
| Supply Current-Max | 0.1 mA | |
| Supply Voltage-Max (Vsup) | 2 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Type | NOR TYPE | |
| Width | 6 mm | |
| Write Protection | HARDWARE/SOFTWARE |