Part Details for S25FS064SDSBHM023 by Cypress Semiconductor
Results Overview of S25FS064SDSBHM023 by Cypress Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
S25FS064SDSBHM023 Information
S25FS064SDSBHM023 by Cypress Semiconductor is a Flash Memory.
Flash Memories are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Part Details for S25FS064SDSBHM023
S25FS064SDSBHM023 CAD Models
S25FS064SDSBHM023 Part Data Attributes
|
S25FS064SDSBHM023
Cypress Semiconductor
Buy Now
Datasheet
|
Compare Parts:
S25FS064SDSBHM023
Cypress Semiconductor
EEPROM,
|
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.1.A | |
HTS Code | 8542.32.00.51 | |
Date Of Intro | 2017-08-23 | |
Clock Frequency-Max (fCLK) | 80 MHz | |
Data Retention Time-Min | 20 | |
Endurance | 100000 Write/Erase Cycles | |
JESD-30 Code | R-PBGA-B24 | |
Length | 8 mm | |
Memory Density | 67108864 bit | |
Memory IC Type | FLASH | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 24 | |
Number of Words | 8388608 words | |
Number of Words Code | 8000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 8MX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TBGA | |
Package Equivalence Code | BGA24,5X5,40 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE | |
Parallel/Serial | SERIAL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Programming Voltage | 1.8 V | |
Screening Level | AEC-Q100 | |
Seated Height-Max | 1.2 mm | |
Serial Bus Type | QSPI | |
Standby Current-Max | 0.00017 A | |
Supply Current-Max | 0.1 mA | |
Supply Voltage-Max (Vsup) | 2 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Type | NOR TYPE | |
Width | 6 mm | |
Write Protection | HARDWARE/SOFTWARE |