Part Details for S25FS064SAGMFM013 by Infineon Technologies AG
Results Overview of S25FS064SAGMFM013 by Infineon Technologies AG
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
S25FS064SAGMFM013 Information
S25FS064SAGMFM013 by Infineon Technologies AG is a Flash Memory.
Flash Memories are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for S25FS064SAGMFM013
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
727-S25FS064SAMFM013
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Mouser Electronics | NOR Flash Nor RoHS: Compliant | 0 |
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$1.8500 / $1.9700 | Order Now |
Part Details for S25FS064SAGMFM013
S25FS064SAGMFM013 CAD Models
S25FS064SAGMFM013 Part Data Attributes
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S25FS064SAGMFM013
Infineon Technologies AG
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Datasheet
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S25FS064SAGMFM013
Infineon Technologies AG
Flash, 8MX8, PDSO8,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Reach Compliance Code | compliant | |
| Samacsys Manufacturer | Infineon | |
| Clock Frequency-Max (fCLK) | 133 MHz | |
| Data Retention Time-Min | 20 | |
| Endurance | 100000 Write/Erase Cycles | |
| JESD-30 Code | S-PDSO-G8 | |
| JESD-609 Code | e3 | |
| Length | 5.28 mm | |
| Memory Density | 67108864 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Number of Words | 8388608 words | |
| Number of Words Code | 8000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 8MX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SOP | |
| Package Equivalence Code | SOP8,.3 | |
| Package Shape | SQUARE | |
| Package Style | SMALL OUTLINE | |
| Parallel/Serial | SERIAL | |
| Programming Voltage | 1.8 V | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 2.16 mm | |
| Serial Bus Type | QSPI | |
| Standby Current-Max | 0.0003 A | |
| Supply Current-Max | 0.1 mA | |
| Supply Voltage-Max (Vsup) | 2 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Type | NOR TYPE | |
| Width | 5.28 mm | |
| Write Protection | HARDWARE/SOFTWARE |
S25FS064SAGMFM013 Frequently Asked Questions (FAQ)
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The S25FS064SAGMFM013 can operate from -40°C to +125°C, with a storage temperature range of -65°C to +150°C.
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The HOLD# pin should be driven low to pause the current operation, and driven high to resume the operation. It's recommended to use the HOLD# pin only during read operations, and not during write or erase operations.
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The recommended power-up sequence is to apply VCC first, followed by VIO, and then the clock signal. The power-down sequence should be reversed.
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The device density and configuration can be determined by reading the Device ID and Configuration Register (CIDR) at address 0x00. The CIDR contains information about the device density, configuration, and other features.
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The WP# pin is used to protect the status register and the non-volatile configuration register from being written. When WP# is low, these registers are write-protected, and when WP# is high, they can be written.