Part Details for S25FL256SAGBHA203 by Infineon Technologies AG
Results Overview of S25FL256SAGBHA203 by Infineon Technologies AG
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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S25FL256SAGBHA203 Information
S25FL256SAGBHA203 by Infineon Technologies AG is a Flash Memory.
Flash Memories are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for S25FL256SAGBHA203
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
448-S25FL256SAGBHA203TR-ND
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DigiKey | IC FLASH 256MBIT SPI/QUAD 24BGA Min Qty: 2500 Lead time: 10 Weeks Container: Tape & Reel (TR) | Temporarily Out of Stock |
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$3.4646 | Buy Now |
DISTI #
727-S25FL256SAGBHA20
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Mouser Electronics | NOR Flash IC 256 Mb FLASH MEMORY RoHS: Compliant | 0 |
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$3.6500 | Order Now |
Part Details for S25FL256SAGBHA203
S25FL256SAGBHA203 CAD Models
S25FL256SAGBHA203 Part Data Attributes
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S25FL256SAGBHA203
Infineon Technologies AG
Buy Now
Datasheet
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S25FL256SAGBHA203
Infineon Technologies AG
Flash, 64MX4, PBGA24,
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Reach Compliance Code | compliant | |
Samacsys Manufacturer | Infineon | |
Additional Feature | ALSO CONFIGURABLE AS 256M X 1 | |
Alternate Memory Width | 2 | |
Clock Frequency-Max (fCLK) | 133 MHz | |
JESD-30 Code | R-PBGA-B24 | |
JESD-609 Code | e1 | |
Length | 8 mm | |
Memory Density | 268435456 bit | |
Memory IC Type | FLASH | |
Memory Width | 8 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 24 | |
Number of Words | 33554432 words | |
Number of Words Code | 32000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 32MX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE | |
Parallel/Serial | SERIAL | |
Programming Voltage | 3 V | |
Screening Level | AEC-Q100 | |
Seated Height-Max | 1.2 mm | |
Supply Current-Max | 0.1 mA | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Type | NOR TYPE | |
Width | 6 mm | |
Write Cycle Time-Max (tWC) | 500 ms |