Datasheets
S25FL128SAGNFB003 by:

Flash, 32MX4, PDSO8,

Part Details for S25FL128SAGNFB003 by Infineon Technologies AG

Results Overview of S25FL128SAGNFB003 by Infineon Technologies AG

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Applications Consumer Electronics Computing and Data Storage Healthcare

S25FL128SAGNFB003 Information

S25FL128SAGNFB003 by Infineon Technologies AG is a Flash Memory.
Flash Memories are under the broader part category of Memory Components.

Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.

Price & Stock for S25FL128SAGNFB003

Part # Distributor Description Stock Price Buy
DISTI # 448-S25FL128SAGNFB003TR-ND
DigiKey IC FLASH 128MBIT SPI/QUAD 8WSON Min Qty: 2500 Lead time: 12 Weeks Container: Tape & Reel (TR) Temporarily Out of Stock
  • 2,500 $3.0631
$3.0631 Buy Now
DISTI # S25FL128SAGNFB003
Avnet Americas NOR Flash 128Mbit 32M X 4Bit/64M X 2Bit/128M X 1Bit Serial-SPI 8-Pin WSON T/R - Tape and Reel (Alt: S25FL128SAGNFB003) RoHS: Compliant Min Qty: 2500 Package Multiple: 2500 Lead time: 12 Weeks, 0 Days Container: Reel 0
  • 2,500 $3.0018
  • 5,000 $2.9865
  • 10,000 $2.9712
  • 15,000 $2.9559
  • 20,000 $2.9406
$2.9406 / $3.0018 Buy Now
DISTI # 727-5FL128SAGNFB003
Mouser Electronics NOR Flash STD SPI RoHS: Compliant 0
  • 2,500 $3.3200
$3.3200 Order Now

Part Details for S25FL128SAGNFB003

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S25FL128SAGNFB003 Part Data Attributes

S25FL128SAGNFB003 Infineon Technologies AG
Buy Now Datasheet
Compare Parts:
S25FL128SAGNFB003 Infineon Technologies AG Flash, 32MX4, PDSO8,
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer INFINEON TECHNOLOGIES AG
Package Description WSON-8
Reach Compliance Code compliant
Factory Lead Time 12 Weeks
Alternate Memory Width 2
Clock Frequency-Max (fCLK) 133 MHz
JESD-30 Code R-PDSO-N8
JESD-609 Code e3
Length 8 mm
Memory Density 134217728 bit
Memory IC Type FLASH
Memory Width 8
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 8
Number of Words 16777216 words
Number of Words Code 16000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 105 °C
Operating Temperature-Min -40 °C
Organization 16MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code HVSON
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial SERIAL
Peak Reflow Temperature (Cel) 260
Programming Voltage 3 V
Screening Level AEC-Q100
Seated Height-Max 0.8 mm
Supply Current-Max 0.1 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Matte Tin (Sn)
Terminal Form NO LEAD
Terminal Pitch 1.27 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30
Type NOR TYPE
Width 6 mm
Write Cycle Time-Max (tWC) 500 ms

S25FL128SAGNFB003 Related Parts

S25FL128SAGNFB003 Frequently Asked Questions (FAQ)

  • The recommended operating temperature range for the S25FL128SAGNFB003 is -40°C to +85°C, as specified in the datasheet. However, it's essential to note that the device can operate at a wider temperature range, but with reduced performance and reliability.

  • During power-up, the HOLD# pin should be kept high until the device is fully powered up and the internal voltage regulator is stable. During power-down, the HOLD# pin should be kept low to ensure that the device enters a low-power state.

  • The S25FL128SAGNFB003 supports up to 100,000 erase cycles per sector, and up to 10,000 erase cycles per block. It's essential to follow the recommended erase and write cycles to ensure the device's reliability and lifespan.

  • The S25FL128SAGNFB003 provides a secure erase feature that can be used to erase sensitive data. For secure boot, you can use the device's built-in security features, such as the One-Time Programmable (OTP) area, to store secure boot code and ensure that only authorized code is executed.

  • To ensure reliable operation, it's essential to follow the recommended PCB layout and design considerations, such as keeping the device's power supply lines separate from the signal lines, using a decoupling capacitor, and minimizing the distance between the device and the controller.

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