Part Details for S25FL064P0XMFI003 by Infineon Technologies AG
Results Overview of S25FL064P0XMFI003 by Infineon Technologies AG
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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S25FL064P0XMFI003 Information
S25FL064P0XMFI003 by Infineon Technologies AG is a Flash Memory.
Flash Memories are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for S25FL064P0XMFI003
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
SP005823206
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EBV Elektronik | NOR Flash SerialSPI 3V33V 64Mbit 64M x 1bit 8ns 16Pin SOIC TR (Alt: SP005823206) RoHS: Compliant Min Qty: 1450 Package Multiple: 1450 Lead time: 26 Weeks, 0 Days | EBV - 0 |
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Part Details for S25FL064P0XMFI003
S25FL064P0XMFI003 CAD Models
S25FL064P0XMFI003 Part Data Attributes
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S25FL064P0XMFI003
Infineon Technologies AG
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Datasheet
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S25FL064P0XMFI003
Infineon Technologies AG
Flash, 8MX8, PDSO16, SOP-16
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | SOP-16 | |
| Reach Compliance Code | compliant | |
| Samacsys Manufacturer | Infineon | |
| Clock Frequency-Max (fCLK) | 104 MHz | |
| Data Retention Time-Min | ||
| Endurance | 100000 Write/Erase Cycles | |
| JESD-30 Code | R-PDSO-G16 | |
| Length | 10.3 mm | |
| Memory Density | 67108864 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 16 | |
| Number of Words | 8388608 words | |
| Number of Words Code | 8000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 8MX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SOP | |
| Package Equivalence Code | SOP16,.4 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Parallel/Serial | SERIAL | |
| Programming Voltage | 3 V | |
| Seated Height-Max | 2.65 mm | |
| Serial Bus Type | QSPI | |
| Standby Current-Max | 0.00001 A | |
| Supply Current-Max | 0.026 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Type | NOR TYPE | |
| Width | 7.5 mm | |
| Write Protection | HARDWARE/SOFTWARE |
S25FL064P0XMFI003 Frequently Asked Questions (FAQ)
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The S25FL064P0XMFI003 has a minimum of 100,000 erase cycles per sector, and a minimum of 10,000 erase cycles per block.
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The HOLD# pin should be driven high during low power modes to prevent the device from responding to external inputs. This ensures that the device remains in a low power state.
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The recommended clock frequency for the S25FL064P0XMFI003 is up to 104 MHz. However, the device can operate at frequencies up to 133 MHz, but with reduced performance and increased power consumption.
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Wear leveling is not implemented by the device itself, but rather by the system software. The system software should implement wear leveling algorithms to ensure that the erase cycles are evenly distributed across the device.
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The main difference between the two devices is the operating voltage range. The S25FL064P0XMFI003 operates from 2.7V to 3.6V, while the S25FL064P0XMFI010 operates from 1.7V to 3.6V.