Part Details for S1M-Q by Diotec Semiconductor AG
Results Overview of S1M-Q by Diotec Semiconductor AG
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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S1M-Q Information
S1M-Q by Diotec Semiconductor AG is a Rectifier Diode.
Rectifier Diodes are under the broader part category of Diodes.
A diode is a electrical part that can control the direction in which the current flows in a device. Consider factors like voltage drop, current capacity, reverse voltage, and operating frequency when selecting a diode. Read more about Diodes on our Diodes part category page.
Price & Stock for S1M-Q
Part # | Distributor | Description | Stock | Price | Buy | |
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Cytech Systems Limited | 7500 |
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RFQ |
Part Details for S1M-Q
S1M-Q CAD Models
S1M-Q Part Data Attributes
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S1M-Q
Diotec Semiconductor AG
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Datasheet
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S1M-Q
Diotec Semiconductor AG
Rectifier Diode, 1 Element, 1A, 1000V V(RRM), Silicon, DO-214AC, SMA, 2 PIN
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | DIOTEC SEMICONDUCTOR AG | |
Reach Compliance Code | not_compliant | |
ECCN Code | EAR99 | |
HTS Code | 8541.10.00.80 | |
Application | GENERAL PURPOSE | |
Configuration | SINGLE | |
Diode Element Material | SILICON | |
Diode Type | RECTIFIER DIODE | |
JEDEC-95 Code | DO-214AC | |
JESD-30 Code | R-PDSO-C2 | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 1 | |
Number of Elements | 1 | |
Number of Phases | 1 | |
Number of Terminals | 2 | |
Operating Temperature-Max | 175 °C | |
Operating Temperature-Min | -50 °C | |
Output Current-Max | 1 A | |
Package Body Material | PLASTIC/EPOXY | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Reference Standard | AEC-Q101 | |
Rep Pk Reverse Voltage-Max | 1000 V | |
Surface Mount | YES | |
Terminal Finish | Matte Tin (Sn) - annealed | |
Terminal Form | C BEND | |
Terminal Position | DUAL |
S1M-Q Frequently Asked Questions (FAQ)
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A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the thermal pad to connect to an inner layer or the backside of the PCB to further improve heat dissipation.
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To ensure reliable operation in high-temperature environments, it's essential to follow the recommended derating curves for the device. Additionally, consider using a heat sink or a thermal interface material to reduce the junction-to-ambient thermal resistance. It's also crucial to ensure good airflow around the device.
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The recommended soldering conditions for S1M-Q are: peak temperature of 260°C, soldering time of 10 seconds, and a temperature profile that follows the JEDEC J-STD-020 standard. It's also important to use a solder with a melting point above 217°C to prevent damage to the device.
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Yes, S1M-Q can be used in switching applications, but it's essential to consider the device's switching characteristics, such as the turn-on and turn-off times, and the maximum allowed switching frequency. The device should be operated within the recommended switching frequency range to prevent overheating and ensure reliable operation.
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To protect the S1M-Q from EOS and ESD, it's recommended to use a TVS (transient voltage suppressor) diode or a varistor in parallel with the device. Additionally, follow proper handling and storage procedures to prevent ESD damage, and use an ESD wrist strap or mat when handling the device.