Part Details for RS1MFSHMXG by Taiwan Semiconductor
Results Overview of RS1MFSHMXG by Taiwan Semiconductor
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Energy and Power Systems
RS1MFSHMXG Information
RS1MFSHMXG by Taiwan Semiconductor is a Rectifier Diode.
Rectifier Diodes are under the broader part category of Diodes.
A diode is a electrical part that can control the direction in which the current flows in a device. Consider factors like voltage drop, current capacity, reverse voltage, and operating frequency when selecting a diode. Read more about Diodes on our Diodes part category page.
Price & Stock for RS1MFSHMXG
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
V72:2272_21808352
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Arrow Electronics | Diode Switching 1KV 1A 2-Pin SOD-128 T/R Automotive AEC-Q101 Min Qty: 1 Package Multiple: 1 Lead time: 32 Weeks Date Code: 1913 Container: Cut Strips | Americas - 26970 |
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$0.0208 / $0.0243 | Buy Now |
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DISTI #
32882894
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Verical | Diode Switching 1KV 1A 2-Pin SOD-128 T/R Automotive AEC-Q101 Min Qty: 283 Package Multiple: 1 Date Code: 1913 | Americas - 26970 |
|
$0.0208 / $0.0225 | Buy Now |
Part Details for RS1MFSHMXG
RS1MFSHMXG CAD Models
RS1MFSHMXG Part Data Attributes
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RS1MFSHMXG
Taiwan Semiconductor
Buy Now
Datasheet
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RS1MFSHMXG
Taiwan Semiconductor
Rectifier Diode,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TAIWAN SEMICONDUCTOR CO LTD | |
| Package Description | SOD-128, 2 PIN | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.10.00.80 | |
| Samacsys Manufacturer | Taiwan Semiconductor | |
| Additional Feature | FREE WHEELING DIODE | |
| Application | FAST RECOVERY | |
| Configuration | SINGLE | |
| Diode Element Material | SILICON | |
| Diode Type | RECTIFIER DIODE | |
| Forward Voltage-Max (VF) | 1.3 V | |
| JESD-30 Code | R-PDSO-F2 | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 1 | |
| Non-rep Pk Forward Current-Max | 30 A | |
| Number of Elements | 1 | |
| Number of Phases | 1 | |
| Number of Terminals | 2 | |
| Operating Temperature-Max | 150 °C | |
| Operating Temperature-Min | -55 °C | |
| Output Current-Max | 1 A | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Reference Standard | AEC-Q101 | |
| Rep Pk Reverse Voltage-Max | 1000 V | |
| Reverse Current-Max | 5 µA | |
| Reverse Recovery Time-Max | 0.5 µs | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | FLAT | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 |
RS1MFSHMXG Frequently Asked Questions (FAQ)
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The recommended PCB layout for optimal thermal performance involves placing thermal vias under the package, using a solid ground plane, and keeping the thermal traces as short and wide as possible. A 4-layer PCB with a dedicated thermal layer is also recommended.
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To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range, use a suitable thermal interface material, and implement a robust cooling system. Additionally, consider using a thermal sensor to monitor the device temperature and implement thermal throttling or shutdown if necessary.
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To prevent damage, handle the device by the body and avoid touching the pins or die. Store the device in a dry, cool place, away from direct sunlight and moisture. Use anti-static packaging and follow proper ESD handling procedures.
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To troubleshoot issues related to power sequencing and voltage regulation, use an oscilloscope to monitor the power rails and verify that the voltage levels are within the recommended specifications. Check the power-up and power-down sequences to ensure they meet the device's requirements. Also, verify that the voltage regulators are properly configured and functioning correctly.
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To minimize EMI and ensure EMC, use a shielded enclosure, keep the device away from high-frequency sources, and use filtering or shielding on the I/O lines. Follow proper PCB layout and routing guidelines, and consider using EMI-absorbing materials or shielding cans.