Part Details for RN1102MFV(TPL3) by Toshiba America Electronic Components
Results Overview of RN1102MFV(TPL3) by Toshiba America Electronic Components
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
RN1102MFV(TPL3) Information
RN1102MFV(TPL3) by Toshiba America Electronic Components is a Small Signal Bipolar Transistor.
Small Signal Bipolar Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for RN1102MFV(TPL3)
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DISTI #
RN1102MFV(TPL3)
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Avnet Americas | - Tape and Reel (Alt: RN1102MFV(TPL3)) RoHS: Compliant Min Qty: 8000 Package Multiple: 8000 Lead time: 111 Weeks, 0 Days Container: Reel | 0 |
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RFQ | |
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Vyrian | Transistors | 1050 |
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RFQ |
Part Details for RN1102MFV(TPL3)
RN1102MFV(TPL3) CAD Models
RN1102MFV(TPL3) Part Data Attributes
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RN1102MFV(TPL3)
Toshiba America Electronic Components
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Datasheet
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RN1102MFV(TPL3)
Toshiba America Electronic Components
Digital Transistors 100mA 50volts 3Pin 10K x 10Kohms
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | TOSHIBA CORP | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| Factory Lead Time | 111 Weeks | |
| Samacsys Manufacturer | Toshiba | |
| Collector Current-Max (IC) | 0.1 A | |
| DC Current Gain-Min (hFE) | 50 | |
| Number of Elements | 1 | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Polarity/Channel Type | NPN | |
| Power Dissipation-Max (Abs) | 0.15 W | |
| Surface Mount | YES | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Transistor Element Material | SILICON |
RN1102MFV(TPL3) Frequently Asked Questions (FAQ)
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Toshiba provides a recommended PCB layout in their application note (TB454A) for the RN1102MFV(TPL3). It's essential to follow this layout to ensure optimal performance, minimize noise, and reduce electromagnetic interference (EMI).
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The RN1102MFV(TPL3) has a thermal pad on the bottom, which should be connected to a thermal ground plane on the PCB. Ensure good thermal conductivity by using a thermal interface material (TIM) and a heat sink if necessary. Follow Toshiba's thermal design guidelines for optimal heat dissipation.
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Toshiba recommends using a 10uF to 22uF ceramic capacitor (X5R or X7R type) as the input capacitor. This value and type provide a good balance between noise filtering and stability. However, the optimal value may vary depending on the specific application and input voltage ripple.
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To ensure stability, follow Toshiba's guidelines for output capacitor selection (22uF to 47uF, X5R or X7R type) and output voltage divider resistor values. Additionally, ensure the PCB layout is well-designed, with minimal noise and EMI. If oscillations occur, try adding a small capacitor (1nF to 10nF) between the output and ground.
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The maximum allowed voltage on the enable pin (EN) is 6V. Exceeding this voltage may damage the device. Ensure the EN pin is driven by a logic signal with a voltage level compatible with the device's recommended operating conditions.