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Part Details for RMLV1616AGSD-5S2#AA1 by Renesas Electronics Corporation
Results Overview of RMLV1616AGSD-5S2#AA1 by Renesas Electronics Corporation
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (8 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
RMLV1616AGSD-5S2#AA1 Information
RMLV1616AGSD-5S2#AA1 by Renesas Electronics Corporation is an SRAM.
SRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for RMLV1616AGSD-5S2#AA1
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
RMLV1616AGSD-5S2#AA1-ND
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DigiKey | IC SRAM 16MBIT PAR 52TSOP II Min Qty: 1 Lead time: 12 Weeks Container: Tray |
485 In Stock |
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$7.4393 / $9.4900 | Buy Now |
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DISTI #
RMLV1616AGSD-5S2#A
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Avnet Americas | SRAM Chip Async Single 3V 16Mbit 1M X 16 55ns 52-Pin TSOP-II - Trays (Alt: RMLV1616AGSD-5S2#A) RoHS: Not Compliant Min Qty: 230 Package Multiple: 230 Lead time: 18 Weeks, 0 Days Container: Tray | 0 |
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$32.4000 | Buy Now |
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DISTI #
968-LV1616AGSD5S2AA1
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Mouser Electronics | SRAM SRAM 16MB X16 3V uTSOP 55NS -40/+85C RoHS: Compliant | 34 |
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$7.3900 / $9.4900 | Buy Now |
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DISTI #
67010970
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Verical | SRAM Chip Async Single 3V/3.3V 16M-bit 2M/1M x 8/16-bit 55ns 52-Pin TSOP-II T/R RoHS: Compliant Min Qty: 2 Package Multiple: 1 Date Code: 2215 | Americas - 554 |
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$18.6614 | Buy Now |
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DISTI #
RMLV1616AGSD-5S2#AA1
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Avnet Silica | SRAM Chip Async Single 3V 16Mbit 1M X 16 55ns 52Pin TSOPII (Alt: RMLV1616AGSD-5S2#AA1) RoHS: Compliant Min Qty: 230 Package Multiple: 230 Lead time: 14 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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DISTI #
RMLV1616AGSD-5S2#AA1
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Chip One Stop | Semiconductors RoHS: Compliant pbFree: Yes Min Qty: 1 Lead time: 0 Weeks, 1 Days Container: Tray | 554 |
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$9.9300 | Buy Now |
Part Details for RMLV1616AGSD-5S2#AA1
RMLV1616AGSD-5S2#AA1 CAD Models
RMLV1616AGSD-5S2#AA1 Part Data Attributes
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RMLV1616AGSD-5S2#AA1
Renesas Electronics Corporation
Buy Now
Datasheet
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Compare Parts:
RMLV1616AGSD-5S2#AA1
Renesas Electronics Corporation
16Mb Advanced LPSRAM (1M word x 16bit / 2M word x 8bit), uTSOP, /Tray
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Part Package Code | uTSOP | |
| Package Description | TSOP2-52 | |
| Pin Count | 52 | |
| Manufacturer Package Code | PTSB0052LD | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Factory Lead Time | 18 Weeks | |
| Samacsys Manufacturer | Renesas Electronics | |
| Access Time-Max | 55 ns | |
| Additional Feature | CAN ALSO BE ORGANISED AS 2M X 8 | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PDSO-G52 | |
| Length | 10.79 mm | |
| Memory Density | 16777216 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 16 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 52 | |
| Number of Words | 1048576 words | |
| Number of Words Code | 1000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 1MX16 | |
| Output Enable | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSSOP | |
| Package Equivalence Code | TSSOP52,.4,16 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Parallel/Serial | PARALLEL | |
| Seated Height-Max | 1.2 mm | |
| Standby Current-Max | 0.0003 A | |
| Standby Voltage-Min | 2.7 V | |
| Supply Current-Max | 0.03 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.4 mm | |
| Terminal Position | DUAL | |
| Width | 8.89 mm |
Alternate Parts for RMLV1616AGSD-5S2#AA1
This table gives cross-reference parts and alternative options found for RMLV1616AGSD-5S2#AA1. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of RMLV1616AGSD-5S2#AA1, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| AS6C1616B-55BINTR | Alliance Memory Inc | $50.9170 | Standard SRAM, 1MX16, 55ns, CMOS, PBGA48, FBGA-48 | RMLV1616AGSD-5S2#AA1 vs AS6C1616B-55BINTR |
| IS62WV102416FBLL-55BLI | Integrated Silicon Solution Inc | Check for Price | Standard SRAM, 1MX16, 55ns, CMOS, PBGA48, MINIBGA-48 | RMLV1616AGSD-5S2#AA1 vs IS62WV102416FBLL-55BLI |
| RMLV1616AGSD-5S2 | Renesas Electronics Corporation | Check for Price | STANDARD SRAM | RMLV1616AGSD-5S2#AA1 vs RMLV1616AGSD-5S2 |
| RMLV1616AGSA-5S2#AA0 | Renesas Electronics Corporation | Check for Price | 16Mb Advanced LPSRAM (1M word x 16bit / 2M word x 8bit), TSOP(48), /Tray | RMLV1616AGSD-5S2#AA1 vs RMLV1616AGSA-5S2#AA0 |
| IS62WV102416FBLL-55BI | Integrated Silicon Solution Inc | Check for Price | Standard SRAM, 1MX16, 55ns, CMOS, PBGA48, MINIBGA-48 | RMLV1616AGSD-5S2#AA1 vs IS62WV102416FBLL-55BI |
| IS62WV102416FBLL-55TLI | Integrated Silicon Solution Inc | Check for Price | Standard SRAM, 1MX16, 55ns, CMOS, PDSO48, TSOP1-48 | RMLV1616AGSD-5S2#AA1 vs IS62WV102416FBLL-55TLI |
| AS6C1616-55TINL | Alliance Memory Inc | Check for Price | Standard SRAM, 1MX16, 55ns, CMOS, PDSO48, 12 X 20 MM, GREEN, MO-142DD, TSOP1-48 | RMLV1616AGSD-5S2#AA1 vs AS6C1616-55TINL |
| AS6C1616B-55TIN | Alliance Memory Inc | Check for Price | Standard SRAM, 1MX16, 55ns, CMOS, PDSO48, TSOP1-48 | RMLV1616AGSD-5S2#AA1 vs AS6C1616B-55TIN |
RMLV1616AGSD-5S2#AA1 Frequently Asked Questions (FAQ)
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The recommended PCB layout for optimal thermal performance involves placing thermal vias under the package, using a solid ground plane, and minimizing the distance between the device and the heat sink. A 4-layer PCB with a dedicated thermal layer is recommended.
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To ensure reliable operation in high-temperature environments, it is essential to follow the recommended thermal design guidelines, use a heat sink with a thermal interface material, and ensure good airflow around the device. Additionally, consider using a thermal monitoring and shutdown mechanism to prevent overheating.
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The recommended power-up sequence is to apply the power supply voltage (VCC) first, followed by the input voltage (VIN). During power-down, the sequence should be reversed. It is essential to ensure that the input voltage is removed before the power supply voltage to prevent damage to the device.
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To handle ESD protection for this device, it is recommended to use a combination of on-chip ESD protection and external ESD protection devices, such as TVS diodes or ESD arrays. Additionally, follow proper handling and storage procedures to prevent ESD damage during manufacturing and assembly.
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The recommended soldering conditions for this device involve using a peak temperature of 260°C, a dwell time of 30-60 seconds, and a soldering iron with a temperature range of 350-400°C. For rework, use a hot air rework station with a temperature range of 200-250°C and a dwell time of 30-60 seconds.