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Part Details for RMLV0408EGSB-4S2#AA1 by Renesas Electronics Corporation
Results Overview of RMLV0408EGSB-4S2#AA1 by Renesas Electronics Corporation
- Distributor Offerings: (11 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (2 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
RMLV0408EGSB-4S2#AA1 Information
RMLV0408EGSB-4S2#AA1 by Renesas Electronics Corporation is an SRAM.
SRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for RMLV0408EGSB-4S2#AA1
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
RMLV0408EGSB-4S2#AA1-ND
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DigiKey | IC SRAM 4MBIT PARALLEL 32TSOP II Min Qty: 1 Lead time: 12 Weeks Container: Tray |
549 In Stock |
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$3.1032 / $3.9200 | Buy Now |
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DISTI #
RMLV0408EGSB-4S2#AA1
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Avnet Americas | SRAM Chip Async Single 3V 4M-Bit 512KWord x 8 45ns 32-Pin TSOP-II Tray - Trays (Alt: RMLV0408EGSB-4S2#AA1) RoHS: Compliant Min Qty: 117 Package Multiple: 1 Lead time: 12 Weeks, 0 Days Container: Tray | 4521 |
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$12.0000 | Buy Now |
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DISTI #
968-V0408EGSB4S2#AA1
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Mouser Electronics | SRAM SRAM 4MB 3V X8 TSOP32 45NS -40TO85C RoHS: Compliant | 1187 |
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$8.3800 / $11.2400 | Buy Now |
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DISTI #
87729998
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Verical | SRAM Chip Async Single 3V/3.3V 4M-bit 512K x 8 45ns 32-Pin TSOP-II Tray RoHS: Compliant Min Qty: 6 Package Multiple: 1 Date Code: 2448 | Americas - 201 |
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$5.2400 / $5.4600 | Buy Now |
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DISTI #
86027555
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Verical | SRAM Chip Async Single 3V/3.3V 4M-bit 512K x 8 45ns 32-Pin TSOP-II Tray RoHS: Compliant Min Qty: 39 Package Multiple: 1 Date Code: 1701 | Americas - 48 |
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$9.8375 | Buy Now |
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Quest Components | 47 |
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$23.9768 / $28.2080 | Buy Now | |
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Rochester Electronics | R5F51305BDFP#50 - 4Mb Advanced LPSRAM (512-kword 8-bit) RoHS: Compliant Status: Active Min Qty: 1 | 48 |
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$6.3000 / $7.8700 | Buy Now |
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DISTI #
RMLV0408EGSB-4S2#AA1
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Avnet Asia | SRAM Chip Async Single 3V 4M-Bit 512KWord x 8 45ns 32-Pin TSOP-II Tray (Alt: RMLV0408EGSB-4S2#AA1) RoHS: Compliant Min Qty: 234 Package Multiple: 117 Lead time: 12 Weeks, 0 Days | 0 |
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RFQ | |
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DISTI #
RMLV0408EGSB-4S2#AA1
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Avnet Silica | SRAM Chip Async Single 3V 4MBit 512KWord x 8 45ns 32Pin TSOPII Tray (Alt: RMLV0408EGSB-4S2#AA1) RoHS: Compliant Min Qty: 117 Package Multiple: 117 Lead time: 14 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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DISTI #
RMLV0408EGSB-4S2#AA1
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Chip One Stop | Semiconductors RoHS: Compliant pbFree: Yes Min Qty: 1 Lead time: 0 Weeks, 1 Days Container: Tray | 201 |
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$4.6000 / $5.4600 | Buy Now |
Part Details for RMLV0408EGSB-4S2#AA1
RMLV0408EGSB-4S2#AA1 CAD Models
RMLV0408EGSB-4S2#AA1 Part Data Attributes
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RMLV0408EGSB-4S2#AA1
Renesas Electronics Corporation
Buy Now
Datasheet
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Compare Parts:
RMLV0408EGSB-4S2#AA1
Renesas Electronics Corporation
4Mb Advanced LPSRAM (512-kword x 8-bit), TSOP(32), /Tray
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Part Package Code | TSOP(32) | |
| Pin Count | 32 | |
| Manufacturer Package Code | PTSB0032DC | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Factory Lead Time | 12 Weeks | |
| Samacsys Manufacturer | Renesas Electronics | |
| Access Time-Max | 45 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PDSO-G32 | |
| Length | 20.95 mm | |
| Memory Density | 4194304 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 512KX8 | |
| Output Characteristics | 3-STATE | |
| Output Enable | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSOP2 | |
| Package Equivalence Code | TSOP32,.46 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE | |
| Parallel/Serial | PARALLEL | |
| Seated Height-Max | 1.2 mm | |
| Standby Current-Max | 0.0003 A | |
| Standby Voltage-Min | 3 V | |
| Supply Current-Max | 0.025 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Width | 10.16 mm |
Alternate Parts for RMLV0408EGSB-4S2#AA1
This table gives cross-reference parts and alternative options found for RMLV0408EGSB-4S2#AA1. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of RMLV0408EGSB-4S2#AA1, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| RMLV0408EGSB-4S2#AA0 | Renesas Electronics Corporation | Check for Price | 4Mb Advanced LPSRAM (512-kword x 8-bit), TSOP(32), /Tray | RMLV0408EGSB-4S2#AA1 vs RMLV0408EGSB-4S2#AA0 |
| RMLV0408EGSB-4S2 | Renesas Electronics Corporation | Check for Price | STANDARD SRAM | RMLV0408EGSB-4S2#AA1 vs RMLV0408EGSB-4S2 |
RMLV0408EGSB-4S2#AA1 Frequently Asked Questions (FAQ)
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Renesas recommends following the PCB layout guidelines in the datasheet and application notes. For thermal management, ensure a minimum of 1mm clearance around the package, and use thermal vias to dissipate heat. A heat sink or thermal pad may be necessary for high-power applications.
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Follow Renesas' EMC guidelines and application notes. Implement proper grounding, shielding, and filtering techniques. Use a common mode choke and ferrite beads to reduce EMI. Ensure a solid ground plane and decouple power supplies to minimize noise.
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Renesas recommends a slow power-up sequence (typically 1-2ms) to ensure proper internal voltage regulation. For power-down, follow a controlled shutdown sequence to prevent damage or latch-up. Refer to the datasheet and application notes for specific guidelines.
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Use Renesas' debugging tools and software, such as the Renesas Starter Kit or IAR Embedded Workbench. Analyze the device's status registers and error flags. Consult the datasheet, application notes, and Renesas' technical support resources for guidance.
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Renesas guarantees the device's reliability and lifespan according to the datasheet specifications. Follow proper storage, handling, and operating conditions to ensure the device meets its expected lifespan. Refer to Renesas' reliability reports and application notes for more information.