Datasheets
RMLV0408EGSA-4S2#KA1 by: Renesas Electronics Corporation

4Mb Advanced LPSRAM (512-kword x 8-bit), sTSOP(32), /Embossed Tape

Part Details for RMLV0408EGSA-4S2#KA1 by Renesas Electronics Corporation

Results Overview of RMLV0408EGSA-4S2#KA1 by Renesas Electronics Corporation

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RMLV0408EGSA-4S2#KA1 Information

RMLV0408EGSA-4S2#KA1 by Renesas Electronics Corporation is an SRAM.
SRAMs are under the broader part category of Memory Components.

Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.

Price & Stock for RMLV0408EGSA-4S2#KA1

Part # Distributor Description Stock Price Buy
DISTI # 68AK8559
Newark Sram, 4Mbit, -40 To 85Deg C Rohs Compliant: Yes |Renesas RMLV0408EGSA-4S2#KA1 RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Cut Tape 22
  • 1 $10.5200
  • 10 $9.9700
  • 25 $9.4700
  • 50 $9.0100
  • 100 $8.5800
  • 250 $8.2600
  • 500 $8.0000
$8.0000 / $10.5200 Buy Now
DISTI # RMLV0408EGSA-4S2#KA1CT-ND
DigiKey IC SRAM 4MBIT PARALLEL 32TSOP I Min Qty: 1 Lead time: 12 Weeks Container: Digi-Reel®, Cut Tape (CT), Tape & Reel (TR) 4077
In Stock
  • 1 $3.8100
  • 10 $3.5470
  • 25 $3.4424
  • 50 $3.3626
  • 100 $3.2830
  • 250 $3.1783
  • 500 $3.0998
  • 1,000 $3.1130
  • 2,000 $3.0343
  • 3,000 $2.9890
$2.9890 / $3.8100 Buy Now
DISTI # RMLV0408EGSA-4S2#K
Avnet Americas SRAM 4MB 3V X8 STSOP32 45NS -40TO85C - Tape and Reel (Alt: RMLV0408EGSA-4S2#K) RoHS: Compliant Min Qty: 1000 Package Multiple: 1000 Lead time: 18 Weeks, 0 Days Container: Reel 0
  • 1 $12.0000
$12.0000 Buy Now
DISTI # 968-V0408EGSA4S2#KA1
Mouser Electronics SRAM SRAM 4MB 3V X8 STSOP32 45NS -40TO85C RoHS: Compliant 1063
  • 1 $4.4100
  • 10 $4.0000
  • 25 $3.9100
  • 100 $3.4900
  • 250 $3.4800
  • 500 $3.3500
  • 1,000 $3.1800
  • 2,000 $3.1500
$3.1500 / $4.4100 Buy Now
DISTI # 65154716
Verical SRAM Chip Async Single 3V/3.3V 4M-bit 512K x 8 45ns RoHS: Compliant Min Qty: 5 Package Multiple: 1 Date Code: 2237 Americas - 936
  • 5 $6.9103
$6.9103 Buy Now
DISTI # RMLV0408EGSA-4S2#KA1
Avnet Asia SRAM 4MB 3V X8 STSOP32 45NS -40TO85C (Alt: RMLV0408EGSA-4S2#KA1) RoHS: Compliant Min Qty: 1000 Package Multiple: 1000 Lead time: 12 Weeks, 0 Days 0
RFQ
DISTI # RMLV0408EGSA-4S2#KA1
Avnet Silica SRAM 4MB 3V X8 STSOP32 45NS 40TO85C (Alt: RMLV0408EGSA-4S2#KA1) RoHS: Compliant Min Qty: 1000 Package Multiple: 1000 Lead time: 14 Weeks, 0 Days Silica - 0
Buy Now
DISTI # RMLV0408EGSA-4S2#KA1
Chip One Stop Semiconductors RoHS: Compliant pbFree: Yes Min Qty: 1 Lead time: 0 Weeks, 1 Days Container: Cut Tape 936
  • 1 $3.7400
$3.7400 Buy Now
Win Source Electronics IC SRAM 4MBIT PARALLEL 32TSOP I 7180
  • 8 $7.8203
  • 18 $6.4167
  • 28 $6.2162
  • 39 $6.0157
  • 50 $5.8151
  • 67 $5.2136
$5.2136 / $7.8203 Buy Now

Part Details for RMLV0408EGSA-4S2#KA1

RMLV0408EGSA-4S2#KA1 CAD Models

RMLV0408EGSA-4S2#KA1 Part Data Attributes

RMLV0408EGSA-4S2#KA1 Renesas Electronics Corporation
Buy Now Datasheet
Compare Parts:
RMLV0408EGSA-4S2#KA1 Renesas Electronics Corporation 4Mb Advanced LPSRAM (512-kword x 8-bit), sTSOP(32), /Embossed Tape
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer RENESAS ELECTRONICS CORP
Part Package Code sTSOP(32)
Pin Count 32
Manufacturer Package Code PTSA0032KJ
Reach Compliance Code compliant
ECCN Code 5A002
HTS Code 8542.32.00.41
Factory Lead Time 18 Weeks
Samacsys Manufacturer Renesas Electronics
Access Time-Max 45 ns
I/O Type COMMON
JESD-30 Code R-PDSO-G32
Length 11.8 mm
Memory Density 4194304 bit
Memory IC Type STANDARD SRAM
Memory Width 8
Moisture Sensitivity Level 3
Number of Functions 1
Number of Ports 1
Number of Terminals 32
Number of Words 524288 words
Number of Words Code 512000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 512KX8
Output Characteristics 3-STATE
Output Enable YES
Package Body Material PLASTIC/EPOXY
Package Code TSOP1
Package Equivalence Code TSSOP32,.56,20
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL
Seated Height-Max 1.2 mm
Standby Current-Max 0.0003 A
Standby Voltage-Min 3 V
Supply Current-Max 0.025 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position DUAL
Width 8 mm

Alternate Parts for RMLV0408EGSA-4S2#KA1

This table gives cross-reference parts and alternative options found for RMLV0408EGSA-4S2#KA1. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of RMLV0408EGSA-4S2#KA1, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
RMLV0408EGSA-4S2#AA1 Renesas Electronics Corporation Check for Price 4Mb Advanced LPSRAM (512-kword x 8-bit), sTSOP(32), /Tray RMLV0408EGSA-4S2#KA1 vs RMLV0408EGSA-4S2#AA1
RMLV0408EGSA-4S2 Renesas Electronics Corporation Check for Price STANDARD SRAM RMLV0408EGSA-4S2#KA1 vs RMLV0408EGSA-4S2
RMLV0408EGSA-4S2#AA0 Renesas Electronics Corporation Check for Price 4Mb Advanced LPSRAM (512-kword x 8-bit), sTSOP(32), /Tray RMLV0408EGSA-4S2#KA1 vs RMLV0408EGSA-4S2#AA0

RMLV0408EGSA-4S2#KA1 Frequently Asked Questions (FAQ)

  • The recommended PCB layout for optimal thermal performance involves placing thermal vias under the package, using a solid ground plane, and minimizing the distance between the device and the heat sink. A 4-layer PCB with a dedicated thermal layer is recommended.

  • To ensure reliable operation in high-temperature environments, it is essential to follow the recommended thermal design guidelines, use a heat sink with a thermal interface material, and ensure good airflow around the device. Additionally, consider using a thermal monitoring and shutdown mechanism to prevent overheating.

  • The input capacitor should be a low-ESR ceramic capacitor with a value of 4.7uF to 10uF, and a voltage rating of 10V or higher. The capacitor should be placed as close to the VIN pin as possible, and the PCB layout should minimize the distance between the capacitor and the VIN pin.

  • To optimize the output capacitor selection, consider the output voltage ripple, output current, and output capacitor ESR. A low-ESR ceramic capacitor with a value of 4.7uF to 10uF and a voltage rating of 2.5V or higher is recommended. The output capacitor should be placed as close to the VOUT pin as possible.

  • The input voltage should be within the recommended range of 2.5V to 5.5V, with a maximum input voltage of 6V. The input voltage should be stable and free of noise, and the input voltage transient response should be within the recommended specifications.

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