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Part Details for RMLV0408EGSA-4S2#AA1 by Renesas Electronics Corporation
Results Overview of RMLV0408EGSA-4S2#AA1 by Renesas Electronics Corporation
- Distributor Offerings: (8 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (2 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
RMLV0408EGSA-4S2#AA1 Information
RMLV0408EGSA-4S2#AA1 by Renesas Electronics Corporation is an SRAM.
SRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for RMLV0408EGSA-4S2#AA1
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
RMLV0408EGSA-4S2#AA1-ND
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DigiKey | IC SRAM 4MBIT PARALLEL 32TSOP I Min Qty: 1 Lead time: 12 Weeks Container: Tray |
100 In Stock |
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$3.0912 / $3.9200 | Buy Now |
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DISTI #
RMLV0408EGSA-4S2#A
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Avnet Americas | IC SRAM 4MBIT 45NS 32STSOP - Trays (Alt: RMLV0408EGSA-4S2#A) RoHS: Compliant Min Qty: 234 Package Multiple: 234 Lead time: 18 Weeks, 0 Days Container: Tray | 0 |
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$13.0200 | Buy Now |
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DISTI #
968-V0408EGSA4S2#AA1
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Mouser Electronics | SRAM SRAM 4MB 3V X8 STSOP32 45NS -40TO85C RoHS: Compliant | 2748 |
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$3.1800 / $4.4100 | Buy Now |
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DISTI #
82095163
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Verical | SRAM Chip Async Single 3V/3.3V 4M-bit 512K x 8 45ns 32-Pin TSOP-I Tray RoHS: Compliant Min Qty: 6 Package Multiple: 1 Date Code: 2349 | Americas - 400 |
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$5.2400 / $5.4600 | Buy Now |
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Quest Components | STANDARD SRAM, 512KX8, 45NS, CMOS, PDSO32 | 152 |
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$21.9344 / $27.4180 | Buy Now |
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DISTI #
RMLV0408EGSA-4S2#AA1
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Avnet Silica | IC SRAM 4MBIT 45NS 32STSOP (Alt: RMLV0408EGSA-4S2#AA1) RoHS: Compliant Min Qty: 234 Package Multiple: 234 Lead time: 14 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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DISTI #
RMLV0408EGSA-4S2#AA1
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Chip One Stop | Semiconductors RoHS: Compliant pbFree: Yes Min Qty: 1 Lead time: 0 Weeks, 1 Days Container: Tray | 400 |
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$4.6000 / $5.4600 | Buy Now |
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Win Source Electronics | IC SRAM 4MBIT PARALLEL 32STSOP / SRAM Memory IC 4Mb (512K x 8) Parallel 45 ns 32-TSOP I | 6970 |
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$5.2136 / $7.8203 | Buy Now |
Part Details for RMLV0408EGSA-4S2#AA1
RMLV0408EGSA-4S2#AA1 CAD Models
RMLV0408EGSA-4S2#AA1 Part Data Attributes
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RMLV0408EGSA-4S2#AA1
Renesas Electronics Corporation
Buy Now
Datasheet
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Compare Parts:
RMLV0408EGSA-4S2#AA1
Renesas Electronics Corporation
4Mb Advanced LPSRAM (512-kword x 8-bit), sTSOP(32), /Tray
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Part Package Code | sTSOP(32) | |
| Pin Count | 32 | |
| Manufacturer Package Code | PTSA0032KJ | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.32.00.41 | |
| Factory Lead Time | 18 Weeks | |
| Samacsys Manufacturer | Renesas Electronics | |
| Access Time-Max | 45 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PDSO-G32 | |
| Length | 11.8 mm | |
| Memory Density | 4194304 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 512KX8 | |
| Output Characteristics | 3-STATE | |
| Output Enable | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSOP1 | |
| Package Equivalence Code | TSSOP32,.56,20 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE | |
| Parallel/Serial | PARALLEL | |
| Seated Height-Max | 1.2 mm | |
| Standby Current-Max | 0.0003 A | |
| Standby Voltage-Min | 3 V | |
| Supply Current-Max | 0.025 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | DUAL | |
| Width | 8 mm |
Alternate Parts for RMLV0408EGSA-4S2#AA1
This table gives cross-reference parts and alternative options found for RMLV0408EGSA-4S2#AA1. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of RMLV0408EGSA-4S2#AA1, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| RMLV0408EGSA-4S2 | Renesas Electronics Corporation | Check for Price | STANDARD SRAM | RMLV0408EGSA-4S2#AA1 vs RMLV0408EGSA-4S2 |
| RMLV0408EGSA-4S2#AA0 | Renesas Electronics Corporation | Check for Price | 4Mb Advanced LPSRAM (512-kword x 8-bit), sTSOP(32), /Tray | RMLV0408EGSA-4S2#AA1 vs RMLV0408EGSA-4S2#AA0 |
RMLV0408EGSA-4S2#AA1 Frequently Asked Questions (FAQ)
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The recommended PCB layout for optimal thermal performance involves placing thermal vias under the package, using a solid ground plane, and minimizing the distance between the device and the heat sink. A 4-layer PCB with a dedicated thermal layer is also recommended.
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To ensure reliable operation in high-temperature environments, it is essential to follow the recommended thermal design guidelines, use a heat sink with a thermal interface material, and ensure good airflow around the device. Additionally, consider using a thermal sensor to monitor the device temperature and implement thermal throttling or shutdown mechanisms if necessary.
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The recommended power-up sequence involves applying the power supply voltage (VCC) before the input voltage (VIN). During power-down, the input voltage (VIN) should be removed before the power supply voltage (VCC). It is also essential to ensure that the device is in a stable state before applying or removing power.
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To handle ESD protection for this device, it is recommended to use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins. Additionally, follow proper handling and storage procedures to prevent ESD damage during manufacturing, testing, and shipping.
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The recommended soldering conditions involve using a soldering iron with a temperature of 350°C (662°F) for a maximum of 3 seconds. For rework, use a rework station with a temperature of 250°C (482°F) for a maximum of 10 seconds. Ensure that the device is not exposed to temperatures above 260°C (500°F) during soldering or rework.