Part Details for R1Q3A7236ABG-33IB0 by Renesas Electronics Corporation
Results Overview of R1Q3A7236ABG-33IB0 by Renesas Electronics Corporation
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
Renewable Energy
Automotive
R1Q3A7236ABG-33IB0 Information
R1Q3A7236ABG-33IB0 by Renesas Electronics Corporation is an SRAM.
SRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for R1Q3A7236ABG-33IB0
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-R1Q3A7236ABG-33IB0-ND
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DigiKey | STANDARD SRAM, 2MX36 Min Qty: 13 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
1104 In Stock |
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$24.0600 | Buy Now |
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DISTI #
86014221
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Verical | SRAM Chip Sync Dual 1.8V 72M-bit 2M x 36 0.45ns 165-Pin LBGA Tray RoHS: Compliant Min Qty: 25 Package Multiple: 1 Date Code: 1701 | Americas - 1104 |
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$23.1250 / $28.9125 | Buy Now |
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Rochester Electronics | Standard SRAM, 2MX36 RoHS: Compliant Status: Obsolete Min Qty: 1 | 1104 |
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$18.5000 / $23.1300 | Buy Now |
Part Details for R1Q3A7236ABG-33IB0
R1Q3A7236ABG-33IB0 CAD Models
R1Q3A7236ABG-33IB0 Part Data Attributes
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R1Q3A7236ABG-33IB0
Renesas Electronics Corporation
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Datasheet
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R1Q3A7236ABG-33IB0
Renesas Electronics Corporation
QDRII/DDRII/ QDRII+/DDRII+ SRAM, LBGA, /Tray
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Part Package Code | LBGA | |
| Pin Count | 165 | |
| Manufacturer Package Code | PLBG0165FD | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.41 | |
| Factory Lead Time | 4 Weeks | |
| Samacsys Manufacturer | Renesas Electronics | |
| Access Time-Max | 0.45 ns | |
| Clock Frequency-Max (fCLK) | 300 MHz | |
| I/O Type | SEPARATE | |
| JESD-30 Code | R-PBGA-B165 | |
| Memory Density | 75497472 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 36 | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 165 | |
| Number of Words | 2097152 words | |
| Number of Words Code | 2000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 2MX36 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA165,11X15,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Standby Voltage-Min | 1.7 V | |
| Supply Current-Max | 0.85 mA | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM |