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PZUxB series - Zener diodes in a SOD323F package@en-us SOD 2-Pin
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
PZU3.0B,115 by Nexperia is a Zener Diode.
Zener Diodes are under the broader part category of Diodes.
A diode is a electrical part that can control the direction in which the current flows in a device. Consider factors like voltage drop, current capacity, reverse voltage, and operating frequency when selecting a diode. Read more about Diodes on our Diodes part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-PZU3.0B,115-ND
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DigiKey | DIODE ZENER 3V 310MW SOD323F Min Qty: 8849 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
22114 In Stock |
|
$0.0300 | Buy Now |
DISTI #
1727-3723-1-ND
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DigiKey | DIODE ZENER 3V 310MW SOD323F Min Qty: 1 Lead time: 8 Weeks Container: Cut Tape (CT), Digi-Reel®, Tape & Reel (TR) | Temporarily Out of Stock |
|
$0.0266 / $0.2400 | Buy Now |
DISTI #
PZU3.0B,115
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Avnet Americas | Diode Zener Single 3V 5% 550mW 2-Pin SOD-323F T/R - Tape and Reel (Alt: PZU3.0B,115) RoHS: Compliant Min Qty: 27000 Package Multiple: 3000 Lead time: 8 Weeks, 0 Days Container: Reel | 0 |
|
$0.0226 / $0.0252 | Buy Now |
DISTI #
771-PZU30B3115
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Mouser Electronics | Zener Diodes Zener voltage regulator diodes in a SOD323F package RoHS: Compliant | 0 |
|
$0.0280 / $0.2400 | Order Now |
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Rochester Electronics | Nexperia PZU3.0B - Zener Diode, 3V, 5%, 0.31W, Unidirectional, SOD2 RoHS: Compliant Status: Active Min Qty: 1 | 8740 |
|
$0.0202 / $0.0326 | Buy Now |
DISTI #
PZU3.0B,115
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Avnet Silica | Diode Zener Single 3V 5 550mW 2Pin SOD323F TR (Alt: PZU3.0B,115) RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Lead time: 10 Weeks, 0 Days | Silica - 0 |
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Buy Now |
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PZU3.0B,115
Nexperia
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Datasheet
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PZU3.0B,115
Nexperia
PZUxB series - Zener diodes in a SOD323F package@en-us SOD 2-Pin
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | NEXPERIA | |
Part Package Code | SOD | |
Package Description | PLASTIC, SC-90, 2 PIN | |
Pin Count | 2 | |
Manufacturer Package Code | SOD323F | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8541.10.00.50 | |
Factory Lead Time | 8 Weeks | |
Date Of Intro | 2017-02-01 | |
Samacsys Manufacturer | Nexperia | |
Configuration | SINGLE | |
Diode Element Material | SILICON | |
Diode Type | ZENER DIODE | |
JESD-30 Code | R-PDSO-F2 | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 1 | |
Number of Elements | 1 | |
Number of Terminals | 2 | |
Operating Temperature-Max | 150 °C | |
Operating Temperature-Min | -65 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Peak Reflow Temperature (Cel) | 260 | |
Polarity | UNIDIRECTIONAL | |
Power Dissipation-Max | 0.31 W | |
Reference Standard | IEC-60134 | |
Reference Voltage-Nom | 3 V | |
Surface Mount | YES | |
Technology | ZENER | |
Terminal Finish | TIN | |
Terminal Form | FLAT | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Voltage Tol-Max | 5% | |
Working Test Current | 5 mA |
The recommended footprint for PZU3.0B,115 is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a solder mask opening of 0.5 mm x 0.5 mm.
The thermal pad of PZU3.0B,115 should be connected to a copper plane on the PCB to ensure good thermal dissipation. A thermal via or a thermal pad with a diameter of at least 1.5 mm is recommended.
The maximum allowed voltage on the gate of PZU3.0B,115 is 20 V, but it's recommended to keep it below 15 V to ensure reliable operation and prevent damage to the device.
Yes, PZU3.0B,115 can be used in high-frequency applications up to 100 kHz, but it's essential to consider the device's parasitic capacitance and inductance, as well as the PCB layout, to minimize losses and ensure stable operation.
To ensure the reliability of PZU3.0B,115 in a high-temperature environment, it's essential to follow the recommended derating curves, keep the junction temperature below 150°C, and use a suitable thermal interface material to improve heat dissipation.