Part Details for PR21555AB by Intel Corporation
Results Overview of PR21555AB by Intel Corporation
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
PR21555AB Information
PR21555AB by Intel Corporation is a Bus Controller.
Bus Controllers are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for PR21555AB
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
|
Bristol Electronics | 2551 |
|
RFQ | ||
|
|
Quest Components | 2040 |
|
$44.6250 / $59.5000 | Buy Now | |
|
|
Component Electronics, Inc | IN STOCK SHIP TODAY | 72 |
|
$37.5000 / $57.6900 | Buy Now |
Part Details for PR21555AB
PR21555AB CAD Models
PR21555AB Part Data Attributes
|
|
PR21555AB
Intel Corporation
Buy Now
Datasheet
|
Compare Parts:
PR21555AB
Intel Corporation
21555 Non-Transparent PCI-to-PCI Bridge, 33 MHz, Pb-Free
|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA-304 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 4 Weeks | |
| Address Bus Width | 64 | |
| Clock Frequency-Max | 33 MHz | |
| External Data Bus Width | 64 | |
| JESD-30 Code | S-PBGA-B304 | |
| Length | 31 mm | |
| Number of Terminals | 304 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA304,23X23,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Seated Height-Max | 2.54 mm | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| uPs/uCs/Peripheral ICs Type | BUS CONTROLLER, PCI |
PR21555AB Frequently Asked Questions (FAQ)
-
Intel provides a reference design guide for the PR21555AB, which includes recommendations for PCB layout, thermal management, and component placement. It's essential to follow these guidelines to ensure optimal performance, thermal efficiency, and reliability.
-
Intel offers a troubleshooting guide for the PR21555AB, which provides step-by-step procedures for identifying and resolving common issues. Additionally, engineers can use Intel's debugging tools and software to diagnose and fix problems.
-
The PR21555AB requires a specific power sequencing and voltage regulation scheme to ensure proper operation. Intel provides detailed guidelines for power supply design, including voltage rails, current limits, and sequencing requirements.
-
Intel provides guidelines for EMC and EMI reduction, including PCB layout considerations, shielding, and filtering recommendations. Engineers should also follow industry standards for EMC and EMI compliance.
-
Intel provides thermal design guidelines, including thermal resistance values, junction temperature limits, and heat sink selection criteria. Engineers should consider these factors when designing a thermal management system for the PR21555AB.