Part Details for PMF170XP,115 by NXP Semiconductors
Results Overview of PMF170XP,115 by NXP Semiconductors
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PMF170XP,115 Information
PMF170XP,115 by NXP Semiconductors is an Other Transistor.
Other Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Part Details for PMF170XP,115
PMF170XP,115 CAD Models
PMF170XP,115 Part Data Attributes
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PMF170XP,115
NXP Semiconductors
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Datasheet
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PMF170XP,115
NXP Semiconductors
PMF170XP - 20 V, 1 A P-channel Trench MOSFET SC-70 3-Pin
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Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | SC-70 | |
Pin Count | 3 | |
Manufacturer Package Code | SOT323 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 |
PMF170XP,115 Frequently Asked Questions (FAQ)
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NXP recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
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To ensure reliable operation at high temperatures, it's essential to follow NXP's recommended thermal design guidelines, including proper heat sinking, thermal interface materials, and PCB layout. Additionally, consider derating the device's power dissipation and voltage ratings according to the operating temperature.
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Although the datasheet specifies the recommended operating voltage range, the maximum allowed voltage on the input pins is typically 5.5V, which is higher than the recommended 5V. However, exceeding this voltage may reduce the device's lifespan or cause permanent damage.
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NXP recommends implementing ESD protection measures, such as using ESD diodes or TVS (Transient Voltage Suppressor) devices, to protect the PMF170XP,115 from electrostatic discharge. Additionally, follow proper handling and storage procedures to minimize the risk of ESD damage.
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NXP recommends a soldering profile with a peak temperature of 260°C (500°F) and a dwell time of 10-30 seconds. It's essential to follow a controlled soldering process to prevent damage to the device.