Part Details for PMEG6045ETP by NXP Semiconductors
Results Overview of PMEG6045ETP by NXP Semiconductors
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PMEG6045ETP Information
PMEG6045ETP by NXP Semiconductors is a Rectifier Diode.
Rectifier Diodes are under the broader part category of Diodes.
A diode is a electrical part that can control the direction in which the current flows in a device. Consider factors like voltage drop, current capacity, reverse voltage, and operating frequency when selecting a diode. Read more about Diodes on our Diodes part category page.
Part Details for PMEG6045ETP
PMEG6045ETP CAD Models
PMEG6045ETP Part Data Attributes
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PMEG6045ETP
NXP Semiconductors
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Datasheet
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PMEG6045ETP
NXP Semiconductors
RECTIFIER DIODE
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| Samacsys Manufacturer | NXP | |
| Application | EFFICIENCY | |
| Configuration | SINGLE | |
| Diode Element Material | SILICON | |
| Diode Type | RECTIFIER DIODE | |
| Forward Voltage-Max (VF) | 0.53 V | |
| JESD-30 Code | R-PDSO-F2 | |
| Moisture Sensitivity Level | 1 | |
| Non-rep Pk Forward Current-Max | 70 A | |
| Number of Elements | 1 | |
| Number of Phases | 1 | |
| Number of Terminals | 2 | |
| Operating Temperature-Max | 175 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Power Dissipation-Max | 0.75 W | |
| Reference Standard | AEC-Q101; IEC-60134 | |
| Rep Pk Reverse Voltage-Max | 60 V | |
| Reverse Current-Max | 400 µA | |
| Reverse Recovery Time-Max | 0.02 µs | |
| Surface Mount | YES | |
| Technology | SCHOTTKY | |
| Terminal Finish | Pure Tin (Sn) | |
| Terminal Form | FLAT | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
PMEG6045ETP Frequently Asked Questions (FAQ)
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NXP recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
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To ensure reliable operation in high-temperature environments, it's essential to follow NXP's recommended thermal design guidelines, including proper heat sinking, thermal interface materials, and PCB layout. Additionally, consider derating the device's power dissipation and operating frequency according to the datasheet's thermal specifications.
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NXP recommends soldering the PMEG6045ETP using a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 20-30 seconds. The recommended soldering profile is available in the NXP application note AN10365.
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To troubleshoot issues with the PGOOD output, verify that the input voltage is within the recommended range, and the output voltage is properly regulated. Check for any short circuits or overloads on the output, and ensure that the PGOOD pin is properly connected to a pull-up resistor and a logic input.
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NXP recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF for the input capacitor (CIN). The capacitor should be placed as close as possible to the VIN pin and have a voltage rating of at least 25V.