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Small Signal Field-Effect Transistor,
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
PJS6839_S1_00001 by PanJit Semiconductor is a Small Signal Field-Effect Transistor.
Small Signal Field-Effect Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
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Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
241-PJS6839_S1_00001
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Mouser Electronics | MOSFETs 60V Dual P-Channel Enhancement Mode MOSFET RoHS: Compliant | 14859 |
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$0.0640 / $0.4200 | Buy Now |
DISTI #
PJS6839-S1
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TME | Transistor: P-MOSFET x2, unipolar, -60V, -300mA, Idm: -1A, 500mW Min Qty: 1 | 2949 |
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$0.0584 / $0.1939 | Buy Now |
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NAC | 60V Dual P-Channel Enhancement Mode MOSFET RoHS: Compliant Min Qty: 30000 Package Multiple: 3000 | 0 |
|
$0.0600 / $0.0700 | Buy Now |
DISTI #
PJS6839_S1_00001
|
Avnet Silica | SG9TRR7HF3KSOT236LMOSSOTNFET60TLMPNF60TLQI04PJ (Alt: PJS6839_S1_00001) RoHS: Compliant Min Qty: 30000 Package Multiple: 3000 Lead time: 27 Weeks, 0 Days | Silica - 30000 |
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Buy Now |
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PJS6839_S1_00001
PanJit Semiconductor
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Datasheet
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Compare Parts:
PJS6839_S1_00001
PanJit Semiconductor
Small Signal Field-Effect Transistor,
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | PANJIT INTERNATIONAL INC | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
Samacsys Manufacturer | PANJIT | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
The recommended PCB layout for optimal performance is not explicitly stated in the datasheet. However, it's essential to follow general guidelines for high-frequency component placement, such as keeping the signal paths short, using a solid ground plane, and minimizing vias and thermal pads.
While the datasheet doesn't provide specific thermal management guidelines, it's crucial to ensure proper heat dissipation. This can be achieved by using a heat sink, thermal interface material, and ensuring good airflow around the component.
The datasheet doesn't specify a recommended soldering process. However, it's recommended to follow the standard reflow soldering process for surface-mount devices, with a peak temperature of 260°C and a dwell time of 30-60 seconds.
While the datasheet doesn't explicitly mention ESD protection, it's essential to follow standard ESD handling procedures, such as using an ESD wrist strap, mat, or workstation, and ensuring that the component is stored in an ESD-safe environment.
The datasheet provides some information on the component's operating temperature range, but it's essential to consider the component's behavior under extreme environmental conditions, such as high humidity, vibration, or radiation. It's recommended to consult with the manufacturer or conduct additional testing to ensure the component's reliability in such conditions.