Part Details for PEX8311-AA66BCF by Broadcom Limited
Results Overview of PEX8311-AA66BCF by Broadcom Limited
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Computing and Data Storage
Financial Technology (Fintech)
Energy and Power Systems
Transportation and Logistics
Electronic Manufacturing
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
PEX8311-AA66BCF Information
PEX8311-AA66BCF by Broadcom Limited is a Bus Controller.
Bus Controllers are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for PEX8311-AA66BCF
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
08P1510
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Newark | Pci Pcie To Local Bus Bridge, 32 Bit, 337-Bga, Pci Ic Type:Pci Express To Local Bus Bridge, Pci Express Base Spec:Pcie 1.0A, Ic Case/Package:Bga, No. Of Pins:337Pins, Supply Voltage Min:3.3V, Supply Voltage Max:1.5V Rohs Compliant: Yes |Broadcom PEX8311-AA66BCF RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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Buy Now | |
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Vyrian | Peripheral ICs | 2901 |
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RFQ | |
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Win Source Electronics | PCI Interface IC PEX 8311 CHIP | 900 |
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$175.0000 / $182.2917 | Buy Now |
Part Details for PEX8311-AA66BCF
PEX8311-AA66BCF CAD Models
PEX8311-AA66BCF Part Data Attributes
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PEX8311-AA66BCF
Broadcom Limited
Buy Now
Datasheet
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Compare Parts:
PEX8311-AA66BCF
Broadcom Limited
PCI Bus Controller, CMOS, PBGA337, 21 X 21 MM, LEAD FREE, PLASTIC, BGA-337
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | BROADCOM INC | |
| Package Description | 21 X 21 MM, LEAD FREE, PLASTIC, BGA-337 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | ||
| Bus Compatibility | PCI | |
| Clock Frequency-Max | 66 MHz | |
| Drive Interface Standard | IEEE 1149.1 | |
| External Data Bus Width | ||
| JESD-30 Code | S-PBGA-B337 | |
| JESD-609 Code | e1 | |
| Length | 21 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 337 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2 mm | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| Supply Voltage-Nom | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | BOTTOM | |
| Width | 21 mm | |
| uPs/uCs/Peripheral ICs Type | BUS CONTROLLER, PCI |
Alternate Parts for PEX8311-AA66BCF
This table gives cross-reference parts and alternative options found for PEX8311-AA66BCF. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PEX8311-AA66BCF, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| PEX8311-AA66BIF | PLX Technology | Check for Price | PCI Bus Controller, CMOS, PBGA337, 21 X 21 MM, ROHS COMPLIANT, PLASTIC, BGA-337 | PEX8311-AA66BCF vs PEX8311-AA66BIF |
PEX8311-AA66BCF Frequently Asked Questions (FAQ)
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A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from noise sources. Use a common mode filter or a ferrite bead to reduce EMI.
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Use a heat sink or a thermal pad to dissipate heat. Ensure good airflow around the device. Consider using a thermal interface material to improve heat transfer. Monitor the device's junction temperature and adjust the system design accordingly.
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In a multi-device system, ensure that each device has a unique device number and that the system is designed to handle the increased power consumption. Use a PCIe switch or a bridge to manage the PCIe lanes and reduce signal degradation.
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Use a logic analyzer or a PCIe protocol analyzer to capture and analyze the PCIe signals. Check the system's power supply and clocking scheme. Verify that the device is properly configured and that the firmware is up-to-date.
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Use the device's power management features, such as ASPM and L1 sub-states, to reduce power consumption. Optimize the system's power delivery network to minimize power losses. Consider using a power-efficient system design and a low-power PCIe device.