Part Details for PCA24S08DP by NXP Semiconductors
Results Overview of PCA24S08DP by NXP Semiconductors
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- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Smart Cities
PCA24S08DP Information
PCA24S08DP by NXP Semiconductors is an EEPROM.
EEPROMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Part Details for PCA24S08DP
PCA24S08DP CAD Models
PCA24S08DP Part Data Attributes
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PCA24S08DP
NXP Semiconductors
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Datasheet
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PCA24S08DP
NXP Semiconductors
IC 1K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 3 MM, PLASTIC, SOT505-1, TSSOP-8, Programmable ROM
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | SOIC | |
| Package Description | 3 MM, PLASTIC, SOT505-1, TSSOP-8 | |
| Pin Count | 8 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Samacsys Manufacturer | NXP | |
| Clock Frequency-Max (fCLK) | 0.4 MHz | |
| Data Retention Time-Min | 10 | |
| Endurance | 100000 Write/Erase Cycles | |
| I2C Control Byte | 10101MMR | |
| JESD-30 Code | S-PDSO-G8 | |
| JESD-609 Code | e3 | |
| Length | 3 mm | |
| Memory Density | 8192 bit | |
| Memory IC Type | EEPROM | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Number of Words | 1024 words | |
| Number of Words Code | 1000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 1KX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSSOP | |
| Package Equivalence Code | TSSOP8,.19 | |
| Package Shape | SQUARE | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.1 mm | |
| Serial Bus Type | I2C | |
| Standby Current-Max | 0.000015 A | |
| Supply Current-Max | 0.001 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 3 mm | |
| Write Protection | HARDWARE/SOFTWARE |