Datasheets
PC28F512P30TFA by:
Micron Technology Inc

Flash, 32MX16, 100ns, PBGA64, BGA-64

Part Details for PC28F512P30TFA by Micron Technology Inc

Results Overview of PC28F512P30TFA by Micron Technology Inc

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PC28F512P30TFA Information

PC28F512P30TFA by Micron Technology Inc is a Flash Memory.
Flash Memories are under the broader part category of Memory Components.

Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.

Price & Stock for PC28F512P30TFA

Part # Distributor Description Stock Price Buy
Win Source Electronics NOR Flash Parallel/Serial 1.8V 512M-bit 32M x 16 100ns 64-Pin BGA Tray / IC FLASH 512M PARALLEL 64EASYBGA 50000
  • 6 $9.9459
  • 13 $9.3042
  • 20 $8.9834
  • 28 $8.3418
  • 36 $8.0209
  • 45 $7.7001
$7.7001 / $9.9459 Buy Now

Part Details for PC28F512P30TFA

PC28F512P30TFA CAD Models

PC28F512P30TFA Part Data Attributes

PC28F512P30TFA Micron Technology Inc
Buy Now Datasheet
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PC28F512P30TFA Micron Technology Inc Flash, 32MX16, 100ns, PBGA64, BGA-64
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC
Package Description BGA-64
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Samacsys Manufacturer Micron
Access Time-Max 100 ns
Additional Feature TOP BOOT
Boot Block TOP
Command User Interface YES
Common Flash Interface YES
Data Polling NO
JESD-30 Code R-PBGA-B64
JESD-609 Code e1
Length 10 mm
Memory Density 536870912 bit
Memory IC Type FLASH
Memory Width 16
Number of Functions 1
Number of Sectors/Size 4,511
Number of Terminals 64
Number of Words 33554432 words
Number of Words Code 32000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 32MX16
Package Body Material PLASTIC/EPOXY
Package Code TBGA
Package Equivalence Code BGA64,8X8,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE
Page Size 16 words
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Programming Voltage 1.8 V
Qualification Status Not Qualified
Seated Height-Max 1.2 mm
Sector Size 16K,64K
Standby Current-Max 0.000225 A
Supply Current-Max 0.031 mA
Supply Voltage-Max (Vsup) 2 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Toggle Bit NO
Type NOR TYPE
Width 8 mm

Alternate Parts for PC28F512P30TFA

This table gives cross-reference parts and alternative options found for PC28F512P30TFA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PC28F512P30TFA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
PC28F512P30TFB Micron Technology Inc Check for Price Flash, 32MX16, 100ns, PBGA64, BGA-64 PC28F512P30TFA vs PC28F512P30TFB
Part Number Manufacturer Composite Price Description Compare
K8C1215ETM-DE1F0 Samsung Semiconductor Check for Price Flash, 32MX16, 110ns, PBGA167, 10.50 X 14 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-167 PC28F512P30TFA vs K8C1215ETM-DE1F0
K8C1215ETM-FE1D0 Samsung Semiconductor Check for Price Flash, 32MX16, 110ns, PBGA167, 10.50 X 14 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FBGA-167 PC28F512P30TFA vs K8C1215ETM-FE1D0
K8C1315ETM-DE1D0 Samsung Semiconductor Check for Price Flash, 32MX16, 110ns, PBGA167, 10.50 X 14 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-167 PC28F512P30TFA vs K8C1315ETM-DE1D0
K8C1215ETM-FE1E0 Samsung Semiconductor Check for Price Flash, 32MX16, 110ns, PBGA167, 10.50 X 14 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FBGA-167 PC28F512P30TFA vs K8C1215ETM-FE1E0
K8C1315ETM-FE1C0 Samsung Semiconductor Check for Price Flash, 32MX16, 110ns, PBGA167, 10.50 X 14 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FBGA-167 PC28F512P30TFA vs K8C1315ETM-FE1C0
K8C1315ETM-FE1E0 Samsung Semiconductor Check for Price Flash, 32MX16, 110ns, PBGA167, 10.50 X 14 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FBGA-167 PC28F512P30TFA vs K8C1315ETM-FE1E0
K8C1315ETM-FC1D0 Samsung Semiconductor Check for Price Flash, 32MX16, 110ns, PBGA167, 10.50 X 14 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FBGA-167 PC28F512P30TFA vs K8C1315ETM-FC1D0
K8C1015ETM-DE1C0 Samsung Semiconductor Check for Price Flash, 32MX16, 110ns, PBGA167, 10.50 X 14 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-167 PC28F512P30TFA vs K8C1015ETM-DE1C0
K8C1115ETM-FE1F0 Samsung Semiconductor Check for Price Flash, 32MX16, 110ns, PBGA167, 10.50 X 14 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FBGA-167 PC28F512P30TFA vs K8C1115ETM-FE1F0
K8C1315ETM-FC1F0 Samsung Semiconductor Check for Price Flash, 32MX16, 110ns, PBGA167, 10.50 X 14 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FBGA-167 PC28F512P30TFA vs K8C1315ETM-FC1F0

PC28F512P30TFA Related Parts

PC28F512P30TFA Frequently Asked Questions (FAQ)

  • The PC28F512P30TFA has an operating temperature range of -40°C to 85°C.

  • The HOLD# signal should be asserted low to pause the current operation and de-asserted high to resume the operation.

  • The WP# signal is used to prevent accidental writes to the device. When WP# is low, the device is in write-protect mode, and when WP# is high, the device is in read/write mode.

  • The PC28F512P30TFA has a density of 512 Mbits and is organized as 64M x 8 bits or 32M x 16 bits.

  • The typical programming time for the PC28F512P30TFA is 10-15 seconds for a full chip erase and 10-20 microseconds for a byte program operation.

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