Datasheets
PBSS5240XF by:

PBSS5240X - 40 V, 2 A PNP low VCEsat (BISS) transistor SOT-89 3-Pin

Part Details for PBSS5240XF by NXP Semiconductors

Results Overview of PBSS5240XF by NXP Semiconductors

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PBSS5240XF Information

PBSS5240XF by NXP Semiconductors is an Other Transistor.
Other Transistors are under the broader part category of Transistors.

A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.

Part Details for PBSS5240XF

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PBSS5240XF Part Data Attributes

PBSS5240XF NXP Semiconductors
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PBSS5240XF NXP Semiconductors PBSS5240X - 40 V, 2 A PNP low VCEsat (BISS) transistor SOT-89 3-Pin
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code SOT-89
Pin Count 3
Manufacturer Package Code SOT89
Reach Compliance Code compliant
ECCN Code EAR99

PBSS5240XF Related Parts

PBSS5240XF Frequently Asked Questions (FAQ)

  • NXP provides a recommended PCB layout in the application note AN11555, which includes guidelines for thermal vias, copper pours, and component placement to ensure optimal thermal performance.

  • The input capacitor selection depends on the input voltage, current, and frequency. NXP recommends using a low-ESR capacitor with a value between 1-10uF, and a voltage rating that matches the input voltage. The application note AN11555 provides more detailed guidance.

  • The maximum allowed voltage on the enable pin (EN) is 6V, as specified in the datasheet. Exceeding this voltage may damage the device.

  • The PBSS5240XF is rated for operation up to 150°C, but the device's performance and reliability may degrade at higher temperatures. NXP recommends using the device within the specified operating temperature range for optimal performance and reliability.

  • NXP provides guidelines for EMC in the application note AN11555, which includes recommendations for PCB layout, component selection, and shielding to minimize electromagnetic interference.

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