Part Details for P5020NSE7TNB by NXP Semiconductors
Results Overview of P5020NSE7TNB by NXP Semiconductors
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
P5020NSE7TNB Information
P5020NSE7TNB by NXP Semiconductors is a Microprocessor.
Microprocessors are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for P5020NSE7TNB
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
85AK9584
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Newark | P5020Nse7Tnb Rohs Compliant: Yes |Nxp P5020NSE7TNB RoHS: Compliant Min Qty: 21 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$457.6900 / $485.6400 | Buy Now |
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DISTI #
P5020NSE7TNB
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EBV Elektronik | MPU QorIQ RISC 64Bit 1333MHz 1295Pin FCBGA Box (Alt: P5020NSE7TNB) RoHS: Compliant Min Qty: 21 Package Multiple: 21 | EBV - 0 |
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Buy Now | |
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Flip Electronics | Stock, ship today | 357 |
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RFQ |
Part Details for P5020NSE7TNB
P5020NSE7TNB CAD Models
P5020NSE7TNB Part Data Attributes
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P5020NSE7TNB
NXP Semiconductors
Buy Now
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P5020NSE7TNB
NXP Semiconductors
RISC PROCESSOR
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | 37.50 X 37.50 MM, 3.53 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, FCBGA-1295 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.1 | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 4 Weeks | |
| Samacsys Manufacturer | NXP | |
| Address Bus Width | 16 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 166 MHz | |
| External Data Bus Width | 64 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B1295 | |
| JESD-609 Code | e1 | |
| Length | 37.5 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 1295 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Peak Reflow Temperature (Cel) | 245 | |
| Seated Height-Max | 3.53 mm | |
| Speed | 1800 MHz | |
| Supply Voltage-Max | 1.15 V | |
| Supply Voltage-Min | 1.05 V | |
| Supply Voltage-Nom | 1.1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 37.5 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
P5020NSE7TNB Frequently Asked Questions (FAQ)
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NXP provides a reference design and layout guidelines in the P5020NSE7TNB Reference Manual (document number P5020RM) and the P5020NSE7TNB Thermal Design Guide (document number P5020TDG). These documents provide detailed information on PCB layout, thermal management, and design considerations.
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To optimize power consumption, use the Power Management Unit (PMU) to dynamically adjust the voltage and frequency of the processor. Additionally, use the Low Power Modes (LPM) and Dynamic Voltage and Frequency Scaling (DVFS) features to reduce power consumption during idle periods. Refer to the P5020NSE7TNB Power Management Guide (document number P5020PMG) for more information.
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The recommended settings for the DDR3 memory interface can be found in the P5020NSE7TNB DDR3 Memory Interface Application Note (document number P5020DDR3AN). This document provides guidance on memory timing, voltage, and signal integrity.
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NXP provides a Secure Boot and Secure Firmware Update solution using the P5020NSE7TNB's built-in security features, such as the Secure Boot ROM and the Cryptographic Acceleration Unit (CAU). Refer to the P5020NSE7TNB Secure Boot and Secure Firmware Update Application Note (document number P5020SBAN) for implementation details.
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The thermal limitations and derating considerations for the P5020NSE7TNB are specified in the P5020NSE7TNB datasheet and the P5020NSE7TNB Thermal Design Guide (document number P5020TDG). These documents provide information on junction temperature, thermal resistance, and derating factors.