Part Details for P5010NXN1QMB by Freescale Semiconductor
Results Overview of P5010NXN1QMB by Freescale Semiconductor
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
P5010NXN1QMB Information
P5010NXN1QMB by Freescale Semiconductor is a Microprocessor.
Microprocessors are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for P5010NXN1QMB
| Part # | Distributor | Description | Stock | Price | Buy | |
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Rochester Electronics | P5010 - QorIQ RISC Microprocessor, Power Architectur , 2000MHz, PBGA1295 RoHS: Compliant Status: Obsolete Min Qty: 1 | 15 |
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$358.4100 / $407.2800 | Buy Now |
Part Details for P5010NXN1QMB
P5010NXN1QMB CAD Models
P5010NXN1QMB Part Data Attributes
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P5010NXN1QMB
Freescale Semiconductor
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Datasheet
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P5010NXN1QMB
Freescale Semiconductor
QorIQ, 64-Bit Power Arch SoC, 1.6GHz, DDR3, PCIe, GbE, SRIO, HW Accel, -40 to 105C Rev 2.0
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| Pbfree Code | No | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
| Package Description | 37.50 X 37.50 MM, 3.53 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, FCBGA-1295 | |
| Reach Compliance Code | not_compliant | |
| Address Bus Width | 16 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 166 MHz | |
| External Data Bus Width | 64 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B1295 | |
| JESD-609 Code | e1 | |
| Length | 37.5 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 1295 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Peak Reflow Temperature (Cel) | 245 | |
| Seated Height-Max | 3.53 mm | |
| Speed | 1600 MHz | |
| Supply Voltage-Max | 1.15 V | |
| Supply Voltage-Min | 1.05 V | |
| Supply Voltage-Nom | 1.1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 37.5 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |