Part Details for P5010NSN1TNB by NXP Semiconductors
Results Overview of P5010NSN1TNB by NXP Semiconductors
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
P5010NSN1TNB Information
P5010NSN1TNB by NXP Semiconductors is a Microprocessor.
Microprocessors are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for P5010NSN1TNB
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
89491736
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Verical | MPU QorIQ P5010 RISC 64bit 45nm 1.8GHz 1295-Pin FCBGA Tray Min Qty: 1 Package Multiple: 1 Date Code: 1601 | Americas - 14 |
|
$412.4875 / $468.7375 | Buy Now |
|
DISTI #
25967633
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Verical | MPU QorIQ P5010 RISC 64bit 45nm 1.8GHz 1295-Pin FCBGA Tray Min Qty: 1 Package Multiple: 1 Date Code: 1311 | Americas - 1 |
|
$274.9800 | Buy Now |
Part Details for P5010NSN1TNB
P5010NSN1TNB CAD Models
P5010NSN1TNB Part Data Attributes
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P5010NSN1TNB
NXP Semiconductors
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P5010NSN1TNB
NXP Semiconductors
RISC PROCESSOR
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | 37.50 X 37.50 MM, 3.53 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, FCBGA-1295 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.A.1 | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 4 Weeks | |
| Address Bus Width | 16 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 166 MHz | |
| External Data Bus Width | 64 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B1295 | |
| JESD-609 Code | e1 | |
| Length | 37.5 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 1295 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Peak Reflow Temperature (Cel) | 245 | |
| Seated Height-Max | 3.53 mm | |
| Speed | 1800 MHz | |
| Supply Voltage-Max | 1.15 V | |
| Supply Voltage-Min | 1.05 V | |
| Supply Voltage-Nom | 1.1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 37.5 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |