Part Details for P1013NXN2HFB by Freescale Semiconductor
Results Overview of P1013NXN2HFB by Freescale Semiconductor
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P1013NXN2HFB Information
P1013NXN2HFB by Freescale Semiconductor is a Microprocessor.
Microprocessors are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Part Details for P1013NXN2HFB
P1013NXN2HFB CAD Models
P1013NXN2HFB Part Data Attributes
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P1013NXN2HFB
Freescale Semiconductor
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Datasheet
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P1013NXN2HFB
Freescale Semiconductor
32-BIT, 800MHz, MICROPROCESSOR, PBGA689, 31 X 31 MM, 2.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGA-689
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
Part Package Code | BGA | |
Package Description | 31 X 31 MM, 2.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGA-689 | |
Pin Count | 689 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Address Bus Width | ||
Bit Size | 32 | |
Boundary Scan | YES | |
Clock Frequency-Max | 133 MHz | |
External Data Bus Width | ||
Format | FLOATING POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-PBGA-B689 | |
JESD-609 Code | e2 | |
Length | 31 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 689 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 2.46 mm | |
Speed | 800 MHz | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 0.95 V | |
Supply Voltage-Nom | 1 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | Tin/Silver (Sn/Ag) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 31 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR |