Part Details for P1013NXN2EFB by NXP Semiconductors
Results Overview of P1013NXN2EFB by NXP Semiconductors
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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P1013NXN2EFB Information
P1013NXN2EFB by NXP Semiconductors is a Microprocessor.
Microprocessors are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for P1013NXN2EFB
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
85AK9464
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Newark | Qoriq, 32 Bit Power Arch Soc, 600Mhz, Gbe, Pcie, Usb, Ddr2/3, Ecc, Lcd, -40 To 125C, Rev 2/ Tray Rohs Compliant: Yes |Nxp P1013NXN2EFB RoHS: Compliant Min Qty: 27 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$71.5300 / $77.1200 | Buy Now |
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DISTI #
P1013NXN2EFB
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Avnet Americas | MPU QorIQ RISC 32-Bit 600MHz 1.5V/1.8V/2.5V/3.3V 689-Pin TEPBGA II Tray - Trays (Alt: P1013NXN2EFB) RoHS: Compliant Min Qty: 6 Package Multiple: 1 Lead time: 0 Weeks, 2 Days Container: Tray | 2696 Partner Stock |
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$98.6328 / $115.9368 | Buy Now |
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Rochester Electronics | 600/400/667 ET TMP NE PBFR RoHS: Compliant Status: Obsolete Min Qty: 1 | 14 |
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$58.8200 / $73.5300 | Buy Now |
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DISTI #
P1013NXN2EFB
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Avnet Silica | MPU QorIQ RISC 32Bit 600MHz 15V18V25V33V 689Pin TEPBGA II Tray (Alt: P1013NXN2EFB) RoHS: Compliant Min Qty: 27 Package Multiple: 27 | Silica - 0 |
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Buy Now | |
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DISTI #
P1013NXN2EFB
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EBV Elektronik | MPU QorIQ RISC 32Bit 600MHz 15V18V25V33V 689Pin TEPBGA II Tray (Alt: P1013NXN2EFB) RoHS: Compliant Min Qty: 27 Package Multiple: 27 | EBV - 0 |
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Buy Now | |
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Flip Electronics | Stock, ship today | 2696 |
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RFQ |
Part Details for P1013NXN2EFB
P1013NXN2EFB CAD Models
P1013NXN2EFB Part Data Attributes
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P1013NXN2EFB
NXP Semiconductors
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P1013NXN2EFB
NXP Semiconductors
32-BIT, 600MHz, MICROPROCESSOR, PBGA689
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | 31 X 31 MM, 2.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGA-689 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 2 Days | |
| Samacsys Manufacturer | NXP | |
| Address Bus Width | ||
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 133 MHz | |
| External Data Bus Width | ||
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B689 | |
| JESD-609 Code | e2 | |
| Length | 31 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 689 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 2.46 mm | |
| Speed | 600 MHz | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 0.95 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | Tin/Silver (Sn/Ag) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 31 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR |
P1013NXN2EFB Frequently Asked Questions (FAQ)
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NXP provides a recommended PCB layout and thermal management guide in their application note AN12269, which includes guidelines for thermal vias, copper pours, and component placement to ensure optimal performance and thermal dissipation.
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NXP recommends using an external power management IC (PMIC) such as the PCA9455 or PCA9456, which can provide power sequencing, voltage monitoring, and reset functionality. The PMIC can be connected to the P1013NXN2EFB's power pins and configured according to the application requirements.
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NXP recommends using 100nF to 1uF decoupling capacitors with a voltage rating of 2.5V or higher, placed as close as possible to the P1013NXN2EFB's power pins. The capacitors should be connected between the power pins and the ground plane to filter out noise and ensure stable operation.
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The P1013NXN2EFB's clocking and reset signals can be configured using the device's clock control registers and reset pins. NXP provides detailed information on clocking and reset configuration in their user manual UM10944, including examples and register settings.
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The P1013NXN2EFB has a maximum junction temperature (Tj) of 125°C. NXP provides thermal derating factors in their datasheet, which should be applied to ensure the device operates within its thermal limits. The derating factors depend on the package type, ambient temperature, and airflow.