Part Details for OMAP3525DCUSA by Texas Instruments
Results Overview of OMAP3525DCUSA by Texas Instruments
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OMAP3525DCUSA Information
OMAP3525DCUSA by Texas Instruments is a Microprocessor.
Microprocessors are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Part Details for OMAP3525DCUSA
OMAP3525DCUSA CAD Models
OMAP3525DCUSA Part Data Attributes
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OMAP3525DCUSA
Texas Instruments
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OMAP3525DCUSA
Texas Instruments
Applications Processor 423-FCBGA -40 to 105
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Pbfree Code | No | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
Part Package Code | BGA | |
Package Description | LFBGA, BGA423,24X24,25 | |
Pin Count | 423 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Address Bus Width | 26 | |
Bit Size | 32 | |
Boundary Scan | YES | |
Clock Frequency-Max | 59 MHz | |
External Data Bus Width | 16 | |
Format | FLOATING POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-PBGA-B423 | |
JESD-609 Code | e1 | |
Length | 16 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 4 | |
Number of Terminals | 423 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA423,24X24,25 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.4 mm | |
Speed | 600 MHz | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
Supply Voltage-Nom | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.65 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 16 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |