Part Details for NX7002BK by NXP Semiconductors
Results Overview of NX7002BK by NXP Semiconductors
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
NX7002BK Information
NX7002BK by NXP Semiconductors is a Small Signal Field-Effect Transistor.
Small Signal Field-Effect Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for NX7002BK
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | Min Qty: 27 | 1085 |
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$0.0562 / $0.1875 | Buy Now |
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Quest Components | 868 |
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$0.0500 / $0.2500 | Buy Now | |
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Win Source Electronics | MOSFET 2N-CH 60V 0.26A 6DFN | 240000 |
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$0.0118 / $0.0176 | Buy Now |
Part Details for NX7002BK
NX7002BK CAD Models
NX7002BK Part Data Attributes
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NX7002BK
NXP Semiconductors
Buy Now
Datasheet
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NX7002BK
NXP Semiconductors
SMALL SIGNAL, FET
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | PLASTIC PACKAGE-3 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| Additional Feature | LOGIC LEVEL COMPATIBLE | |
| Configuration | SINGLE WITH BUILT-IN DIODE | |
| DS Breakdown Voltage-Min | 60 V | |
| Drain Current-Max (ID) | 0.27 A | |
| Drain-source On Resistance-Max | 3.2 Ω | |
| FET Technology | METAL-OXIDE SEMICONDUCTOR | |
| JEDEC-95 Code | TO-236AB | |
| JESD-30 Code | R-PDSO-G3 | |
| Number of Elements | 1 | |
| Number of Terminals | 3 | |
| Operating Mode | ENHANCEMENT MODE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Polarity/Channel Type | N-CHANNEL | |
| Reference Standard | IEC-60134 | |
| Surface Mount | YES | |
| Terminal Form | GULL WING | |
| Terminal Position | DUAL | |
| Transistor Application | SWITCHING | |
| Transistor Element Material | SILICON |
NX7002BK Frequently Asked Questions (FAQ)
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A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the high-frequency signals away from the power plane and use a via stitching technique to reduce EMI.
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Implement thermal management techniques such as heat sinks, thermal vias, and thermal interface materials. Ensure good airflow and avoid overheating by keeping the device within the recommended operating temperature range.
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Use ESD protection diodes, such as the NXP PCA9455, and follow proper PCB layout guidelines to minimize ESD susceptibility. Ensure that the device is handled and stored in an ESD-safe environment.
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Use the device's power-down modes, reduce the clock frequency, and minimize the number of active circuits. Implement power gating and use low-power modes for peripherals and interfaces when not in use.
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Use a logic analyzer or oscilloscope to monitor signals, implement debug interfaces like JTAG or UART, and use NXP's development tools and software development kits (SDKs) for debugging and troubleshooting.