Part Details for NX7002AK,215 by NXP Semiconductors
Results Overview of NX7002AK,215 by NXP Semiconductors
- Distributor Offerings: (7 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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NX7002AK,215 Information
NX7002AK,215 by NXP Semiconductors is a Small Signal Field-Effect Transistor.
Small Signal Field-Effect Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for NX7002AK,215
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
86007830
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Verical | Trans MOSFET N-CH 60V 0.19A 3-Pin SOT-23 T/R RoHS: Compliant Min Qty: 11195 Package Multiple: 1 Date Code: 1601 | Americas - 359600 |
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$0.0335 | Buy Now |
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DISTI #
86007927
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Verical | Trans MOSFET N-CH 60V 0.19A 3-Pin SOT-23 T/R RoHS: Compliant Min Qty: 11195 Package Multiple: 1 Date Code: 1701 | Americas - 31428 |
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$0.0335 | Buy Now |
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Bristol Electronics | 59303 |
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RFQ | ||
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Quest Components | SMALL SIGNAL FIELD-EFFECT TRANSISTOR, 0.19A I(D), 60V, 1-ELEMENT, N-CHANNEL, SILICON, METAL-OXIDE SEMICONDUCTOR FET, TO-236AB | 3112 |
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$0.0438 / $0.1460 | Buy Now |
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Quest Components | SMALL SIGNAL FIELD-EFFECT TRANSISTOR, 0.19A I(D), 60V, 1-ELEMENT, N-CHANNEL, SILICON, METAL-OXIDE SEMICONDUCTOR FET, TO-236AB | 2400 |
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$0.0438 / $0.1460 | Buy Now |
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Quest Components | SMALL SIGNAL FIELD-EFFECT TRANSISTOR, 0.19A I(D), 60V, 1-ELEMENT, N-CHANNEL, SILICON, METAL-OXIDE SEMICONDUCTOR FET, TO-236AB | 265 |
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$0.0365 / $0.0584 | Buy Now |
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Rochester Electronics | NX7002AK - Small Signal Field-Effect Transistor, 0.3A, 60V, N-Channel, MOSFET, TO-236AB RoHS: Compliant Status: Active Min Qty: 1 | 391028 |
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$0.0166 / $0.0268 | Buy Now |
Part Details for NX7002AK,215
NX7002AK,215 CAD Models
NX7002AK,215 Part Data Attributes
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NX7002AK,215
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
NX7002AK,215
NXP Semiconductors
NX7002AK. - 60V, N-channel Trench MOSFET TO-236 3-Pin
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | TO-236 | |
| Package Description | PLASTIC PACKAGE-3 | |
| Pin Count | 3 | |
| Manufacturer Package Code | SOT23 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| Samacsys Manufacturer | NXP | |
| Configuration | SINGLE WITH BUILT-IN DIODE | |
| DS Breakdown Voltage-Min | 60 V | |
| Drain Current-Max (ID) | 0.19 A | |
| Drain-source On Resistance-Max | 5.2 Ω | |
| FET Technology | METAL-OXIDE SEMICONDUCTOR | |
| JEDEC-95 Code | TO-236AB | |
| JESD-30 Code | R-PDSO-G3 | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 1 | |
| Number of Elements | 1 | |
| Number of Terminals | 3 | |
| Operating Mode | ENHANCEMENT MODE | |
| Operating Temperature-Max | 150 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Polarity/Channel Type | N-CHANNEL | |
| Power Dissipation-Max (Abs) | 1.33 W | |
| Reference Standard | IEC-60134 | |
| Surface Mount | YES | |
| Terminal Finish | TIN | |
| Terminal Form | GULL WING | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Transistor Application | SWITCHING | |
| Transistor Element Material | SILICON |
NX7002AK,215 Frequently Asked Questions (FAQ)
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A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the IC.
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Use a shielded enclosure, keep sensitive analog traces away from digital traces, and use a common mode choke or ferrite bead on the power lines. Ensure a solid ground plane and decouple the power supply.
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Power up the VCC pin first, followed by the VDD pin. Ensure a minimum of 10 ms delay between power-up and signal application.
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The thermal shutdown feature is enabled by default. If the junction temperature exceeds 150°C, the device will shut down. Ensure proper heat sinking and thermal design to prevent thermal shutdown.
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A 10 μF ceramic capacitor with an ESR of 1 Ω or less is recommended. Ensure the capacitor is placed close to the VCC pin.