Part Details for NTMS4872NR2G by onsemi
Results Overview of NTMS4872NR2G by onsemi
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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NTMS4872NR2G Information
NTMS4872NR2G by onsemi is a Small Signal Field-Effect Transistor.
Small Signal Field-Effect Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for NTMS4872NR2G
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
86134908
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Verical | Trans MOSFET N-CH 30V 8A 8-Pin SOIC N T/R RoHS: Compliant Min Qty: 1441 Package Multiple: 1 Date Code: 1001 | Americas - 187915 |
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$0.1945 / $0.2604 | Buy Now |
DISTI #
86127180
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Verical | Trans MOSFET N-CH 30V 8A 8-Pin SOIC N T/R RoHS: Compliant Min Qty: 1441 Package Multiple: 1 | Americas - 5925 |
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$0.1945 / $0.2604 | Buy Now |
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Rochester Electronics | Small Signal Field-Effect Transistor, 6A, 30V, N-Channel MOSFET RoHS: Compliant Status: Obsolete Min Qty: 1 | 193840 |
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$0.1556 / $0.2510 | Buy Now |
Part Details for NTMS4872NR2G
NTMS4872NR2G CAD Models
NTMS4872NR2G Part Data Attributes
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NTMS4872NR2G
onsemi
Buy Now
Datasheet
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Compare Parts:
NTMS4872NR2G
onsemi
30 V, 10.2 A, 13.5 mOhm Single N-Channel Power MOSFET, SO-8, SOIC-8 Narrow Body, 2500-REEL
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ONSEMI | |
Part Package Code | SOIC-8 Narrow Body | |
Package Description | SOIC-8NB, 8 PIN | |
Pin Count | 8 | |
Manufacturer Package Code | 751-07 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
Factory Lead Time | 4 Weeks | |
Samacsys Manufacturer | onsemi | |
Avalanche Energy Rating (Eas) | 24.5 mJ | |
Configuration | SINGLE WITH BUILT-IN DIODE | |
DS Breakdown Voltage-Min | 30 V | |
Drain Current-Max (ID) | 6 A | |
Drain-source On Resistance-Max | 0.0135 Ω | |
FET Technology | METAL-OXIDE SEMICONDUCTOR | |
Feedback Cap-Max (Crss) | 200 pF | |
JESD-30 Code | R-PDSO-G8 | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 1 | |
Number of Elements | 1 | |
Number of Terminals | 8 | |
Operating Mode | ENHANCEMENT MODE | |
Operating Temperature-Max | 150 °C | |
Operating Temperature-Min | -55 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Polarity/Channel Type | N-CHANNEL | |
Power Dissipation-Max (Abs) | 1.49 W | |
Pulsed Drain Current-Max (IDM) | 56 A | |
Qualification Status | Not Qualified | |
Surface Mount | YES | |
Terminal Finish | Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Transistor Application | SWITCHING | |
Transistor Element Material | SILICON | |
Turn-off Time-Max (toff) | 44 ns | |
Turn-on Time-Max (ton) | 50 ns |
NTMS4872NR2G Frequently Asked Questions (FAQ)
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A good PCB layout for optimal thermal performance involves placing thermal vias under the IC, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the IC and to connect it to a heat sink or a thermal plane.
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To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, use a suitable heat sink, and ensure good thermal conductivity between the IC and the heat sink. Additionally, consider using thermal interface materials and following proper PCB design guidelines for thermal management.
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Operating the device at the maximum junction temperature (TJ) of 150°C can reduce its lifespan and reliability. It's recommended to operate the device at a lower temperature to ensure optimal performance and longevity. A general rule of thumb is to keep the junction temperature at least 20°C below the maximum rating.
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The NTMS4872NR2G has built-in ESD protection, but it's still essential to follow proper ESD handling procedures during manufacturing, assembly, and testing. This includes using ESD-safe materials, grounding straps, and following proper handling techniques to prevent damage to the device.
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The recommended test and measurement methods for characterizing the NTMS4872NR2G include using a curve tracer or a semiconductor parameter analyzer to measure the device's electrical characteristics, such as voltage and current ratings, and using a thermal camera or thermocouple to measure the device's temperature.