Datasheets
NTMFS4H01NT1G by:

Single N−Channel Power MOSFET 25V, 334A, 0.7mΩ, DFN5 5X6, 1.27P (SO 8FL), 1500-REEL

Part Details for NTMFS4H01NT1G by onsemi

Results Overview of NTMFS4H01NT1G by onsemi

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NTMFS4H01NT1G Information

NTMFS4H01NT1G by onsemi is a Power Field-Effect Transistor.
Power Field-Effect Transistors are under the broader part category of Transistors.

A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.

Price & Stock for NTMFS4H01NT1G

Part # Distributor Description Stock Price Buy
DISTI # 68X4379
Newark Nfet So8Fl 25V 334A 700Mo/Reel Rohs Compliant: Yes |Onsemi NTMFS4H01NT1G RoHS: Compliant Min Qty: 1500 Package Multiple: 1 Date Code: 0 Container: Reel 0
Buy Now
DISTI # NTMFS4H01NT1G
Avnet Silica Trans MOSFET NCH 25V 54A 8Pin SOFL TR (Alt: NTMFS4H01NT1G) RoHS: Compliant Min Qty: 1500 Package Multiple: 1500 Lead time: 143 Weeks, 0 Days Silica - 0
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Cytech Systems Limited MOSFET N-CH 25V 54A/334A 5DFN 960
RFQ

Part Details for NTMFS4H01NT1G

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NTMFS4H01NT1G Part Data Attributes

NTMFS4H01NT1G onsemi
Buy Now Datasheet
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NTMFS4H01NT1G onsemi Single N−Channel Power MOSFET 25V, 334A, 0.7mΩ, DFN5 5X6, 1.27P (SO 8FL), 1500-REEL
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer ONSEMI
Part Package Code DFN5 5X6, 1.27P (SO 8FL)
Manufacturer Package Code 488AA
Reach Compliance Code not_compliant
ECCN Code EAR99
Samacsys Manufacturer onsemi
Avalanche Energy Rating (Eas) 505 mJ
Case Connection DRAIN
Configuration SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min 25 V
Drain Current-Max (ID) 54 A
Drain-source On Resistance-Max 0.00097 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR
Feedback Cap-Max (Crss) 212 pF
JESD-30 Code R-PDSO-F5
JESD-609 Code e3
Moisture Sensitivity Level 1
Number of Elements 1
Number of Terminals 5
Operating Mode ENHANCEMENT MODE
Operating Temperature-Max 150 °C
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Polarity/Channel Type N-CHANNEL
Power Dissipation-Max (Abs) 125 W
Pulsed Drain Current-Max (IDM) 568 A
Surface Mount YES
Terminal Finish Matte Tin (Sn) - annealed
Terminal Form FLAT
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30
Transistor Application SWITCHING
Transistor Element Material SILICON

NTMFS4H01NT1G Related Parts

NTMFS4H01NT1G Frequently Asked Questions (FAQ)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.

  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C.

  • Follow the onsemi recommended soldering profile: peak temperature 260°C, time above 217°C 60s max. For rework, use a low-temperature soldering iron (<350°C) and avoid applying excessive force or pressure.

  • Use ESD-protective packaging, wrist straps, and mats. Ground all equipment and personnel before handling the device. Avoid touching the device's pins or leads.

  • Store the device in its original packaging, away from direct sunlight, moisture, and extreme temperatures (-40°C to 40°C). Handle the device by the body, not the leads.

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