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8-Bit Dual-Supply Non-Inverting Level Translator, SOIC-20 WB, 1000-REEL
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
NLSV8T244DWR2G by onsemi is a Bus Driver/Transceiver.
Bus Driver/Transceivers are under the broader part category of Logic Components.
Digital logic governs the behavior of signals in electronic circuits, enabling complex decisions based on simple binary inputs (yes/no). Logic components perform operations from these signals. Read more about Logic Components on our Logic part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
34R4293
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Newark | 8 Bit Unidirectional Tran/Reel |Onsemi NLSV8T244DWR2G RoHS: Not Compliant Min Qty: 1000 Package Multiple: 1 Date Code: 0 Container: Reel | 0 |
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$2.0000 / $2.5500 | Buy Now |
DISTI #
NLSV8T244DWR2G
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TME | IC: digital, Ch: 8, 0.9÷4.5VDC, SMD, SO20, -40÷85°C, reel,tape, IN: 8 Min Qty: 1 | 0 |
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$1.3600 / $1.8200 | RFQ |
DISTI #
NLSV8T244DWR2G
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IBS Electronics | VOLTAGE LEVEL TRANSLATOR 8-CH UNIDIRECTIONAL 20-PIN SOIC W T/R Min Qty: 1000 Package Multiple: 1 | 0 |
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$3.1850 | Buy Now |
DISTI #
NLSV8T244DWR2G
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Avnet Silica | Voltage Level Translator 8 Input 16 ns 09 V to 45 V 20 Pins WSOIC (Alt: NLSV8T244DWR2G) RoHS: Compliant Min Qty: 1000 Package Multiple: 1000 Lead time: 143 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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Cytech Systems Limited | IC TRANSLATOR UNIDIR 20SOIC | 3000 |
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RFQ | |
DISTI #
NLSV8T244DWR2G
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EBV Elektronik | Voltage Level Translator 8 Input 16 ns 09 V to 45 V 20 Pins WSOIC (Alt: NLSV8T244DWR2G) RoHS: Compliant Min Qty: 1000 Package Multiple: 1000 Lead time: 143 Weeks, 0 Days | EBV - 0 |
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Buy Now | |
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Flip Electronics | Stock | 2000 |
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RFQ |
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NLSV8T244DWR2G
onsemi
Buy Now
Datasheet
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Compare Parts:
NLSV8T244DWR2G
onsemi
8-Bit Dual-Supply Non-Inverting Level Translator, SOIC-20 WB, 1000-REEL
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ONSEMI | |
Part Package Code | SOIC-20 WB | |
Package Description | SOIC-20 | |
Pin Count | 20 | |
Manufacturer Package Code | 751D-05 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Factory Lead Time | 4 Weeks | |
Samacsys Manufacturer | onsemi | |
Family | 8T | |
JESD-30 Code | R-PDSO-G20 | |
JESD-609 Code | e3 | |
Length | 12.8 mm | |
Logic IC Type | REGISTERED BUS TRANSCEIVER | |
Moisture Sensitivity Level | 3 | |
Number of Bits | 8 | |
Number of Functions | 1 | |
Number of Ports | 2 | |
Number of Terminals | 20 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Output Characteristics | 3-STATE | |
Output Polarity | TRUE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | SOP | |
Package Equivalence Code | SOP20,.4 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Peak Reflow Temperature (Cel) | 260 | |
Propagation Delay (tpd) | 3.3 ns | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.65 mm | |
Supply Voltage-Max (Vsup) | 4.5 V | |
Supply Voltage-Min (Vsup) | 0.9 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | MATTE TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 1.27 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 7.5 mm |
A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal resistance. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
Exceeding the maximum Tj rating can lead to reduced device lifespan, increased thermal resistance, and potentially catastrophic failure. Ensure that the device is operated within the recommended temperature range to maintain reliability.
Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins to protect against electrostatic discharge. Follow proper PCB design and layout guidelines to minimize ESD susceptibility.
Use a soldering temperature of 260°C (500°F) for a maximum of 10 seconds. Ensure that the soldering iron is set to a low temperature and the device is not exposed to excessive heat or moisture.