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Part Details for NCP130AMX120TCG by onsemi
Results Overview of NCP130AMX120TCG by onsemi
- Distributor Offerings: (19 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (5 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
NCP130AMX120TCG Information
NCP130AMX120TCG by onsemi is a Linear Regulator IC.
Linear Regulator ICs are under the broader part category of Power Circuits.
A power circuit delivers electricity in order to operate a load for an electronic device. Power circuits include transformers, generators and switches. Read more about Power Circuits on our Power Circuits part category page.
Price & Stock for NCP130AMX120TCG
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
68X4120
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Newark | 300Ma Vldo Bias Rail Cmos Vreg, Ad Option, Vout=1.2V/ Reel |Onsemi NCP130AMX120TCG RoHS: Not Compliant Min Qty: 5000 Package Multiple: 1 Date Code: 0 Container: Reel | 0 |
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$0.1550 / $0.2020 | Buy Now |
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DISTI #
NCP130AMX120TCGOSCT-ND
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DigiKey | IC REG LINEAR 1.2V 300MA 6-XDFN Min Qty: 1 Lead time: 9 Weeks Container: Digi-Reel®, Cut Tape (CT), Tape & Reel (TR) |
1073 In Stock |
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$0.1497 / $0.8800 | Buy Now |
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DISTI #
NCP130AMX120TCG
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Avnet Americas | LDO Voltage Regulator, Fixed, 800 mV to 5.5 V, Single Output, 75 mV Drop, 1.2 V, 300 mA, 6 Pins, XDFN-EP - Tape and Reel (Alt: NCP130AMX120TCG) RoHS: Compliant Min Qty: 5000 Package Multiple: 5000 Lead time: 9 Weeks, 0 Days Container: Reel | 5000 Factory Stock |
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$0.1479 / $0.1619 | Buy Now |
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DISTI #
863-NCP130AMX120TCG
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Mouser Electronics | LDO Voltage Regulators 300MA VLDO BIAS RAIL CMOS RoHS: Compliant | 349 |
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$0.1500 / $0.8800 | Buy Now |
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Onlinecomponents.com | Linear Voltage Regulator IC Positive Fixed 1 Output 1.2V 300mA 6-XDFN (1.2x1.2 RoHS: Compliant | 0 |
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$0.1435 / $0.1576 | Buy Now |
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DISTI #
86001425
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Verical | LDO Regulator Pos 1.2V 0.3A 6-Pin XDFN EP T/R RoHS: Compliant Min Qty: 1782 Package Multiple: 1 Date Code: 2301 | Americas - 304271 |
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$0.1573 / $0.2105 | Buy Now |
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DISTI #
86002291
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Verical | LDO Regulator Pos 1.2V 0.3A 6-Pin XDFN EP T/R RoHS: Compliant Min Qty: 1782 Package Multiple: 1 Date Code: 2201 | Americas - 23613 |
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$0.1573 / $0.2105 | Buy Now |
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DISTI #
86012122
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Verical | LDO Regulator Pos 1.2V 0.3A 6-Pin XDFN EP T/R RoHS: Compliant Min Qty: 1782 Package Multiple: 1 Date Code: 2101 | Americas - 11927 |
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$0.1573 / $0.2105 | Buy Now |
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DISTI #
87650632
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Verical | LDO Regulator Pos 1.2V 0.3A 6-Pin XDFN EP T/R RoHS: Compliant Min Qty: 5000 Package Multiple: 5000 | Americas - 5000 |
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$0.1507 | Buy Now |
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Rochester Electronics | Fixed Positive LDO Regulator, 1.2V, 0.15V Dropout, CMOS, PDSO6 RoHS: Compliant Status: Active Min Qty: 1 | 339811 |
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$0.1258 / $0.2029 | Buy Now |
Part Details for NCP130AMX120TCG
NCP130AMX120TCG CAD Models
NCP130AMX120TCG Part Data Attributes
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NCP130AMX120TCG
onsemi
Buy Now
Datasheet
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Compare Parts:
NCP130AMX120TCG
onsemi
LDO Regulator, 300 mA, Ultra-Low Dropout, High PSRR, with Bias Rail 1.2V Output Active Discharge, XDFN-6, 5000-REEL
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ONSEMI | |
| Part Package Code | XDFN-6 | |
| Manufacturer Package Code | 711AT | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 9 Weeks | |
| Samacsys Manufacturer | onsemi | |
| Adjustability | FIXED | |
| Dropout Voltage1-Max | 0.15 V | |
| Dropout Voltage1-Nom | 0.075 V | |
| Input Voltage Absolute-Max | 6 V | |
| Input Voltage-Max | 5.5 V | |
| Input Voltage-Min | 1.35 V | |
| JESD-30 Code | S-PDSO-N6 | |
| JESD-609 Code | e3 | |
| Length | 1.2 mm | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Outputs | 1 | |
| Number of Terminals | 6 | |
| Operating Temperature TJ-Max | 85 °C | |
| Operating Temperature TJ-Min | -40 °C | |
| Output Current1-Max | 0.3 A | |
| Output Voltage1-Max | 1.218 V | |
| Output Voltage1-Min | 1.182 V | |
| Output Voltage1-Nom | 1.2 V | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HVSON | |
| Package Equivalence Code | SOLCC6,.05,16 | |
| Package Shape | SQUARE | |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Packing Method | TR | |
| Peak Reflow Temperature (Cel) | 260 | |
| Regulator Type | FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR | |
| Seated Height-Max | 0.45 mm | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Matte Tin (Sn) - annealed | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.4 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Voltage Tolerance-Max | 1.5% | |
| Width | 1.2 mm |
Alternate Parts for NCP130AMX120TCG
This table gives cross-reference parts and alternative options found for NCP130AMX120TCG. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of NCP130AMX120TCG, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| NCP130AMX115TCG | onsemi | $0.2328 | LDO Regulator, 300 mA, Ultra-Low Dropout, High PSRR, with Bias Rail 1.15V Output Active Discharge, XDFN-6, 5000-REEL | NCP130AMX120TCG vs NCP130AMX115TCG |
| NCP130BMX120TCG | onsemi | $0.2374 | LDO Regulator, 300 mA, Ultra-Low Dropout, High PSRR, with Bias Rail 1.2V non-Active Discharge, XDFN-6, 5000-REEL | NCP130AMX120TCG vs NCP130BMX120TCG |
| NCP130BMX110TCG | onsemi | $0.2454 | LDO Regulator, 300 mA, Ultra-Low Dropout, High PSRR, with Bias Rail 1.1V non-Active Discharge, XDFN-6, 5000-REEL | NCP130AMX120TCG vs NCP130BMX110TCG |
| NCP130BMX115TCG | onsemi | $0.2454 | LDO Regulator, 300 mA, Ultra-Low Dropout, High PSRR, with Bias Rail 1.15V non-Active Discharge, XDFN-6, 5000-REEL | NCP130AMX120TCG vs NCP130BMX115TCG |
| NCP130BMX105TCG | onsemi | $0.2794 | LDO Regulator, 300 mA, Ultra-Low Dropout, High PSRR, with Bias Rail 1.05V non-Active Discharge, XDFN-6, 5000-REEL | NCP130AMX120TCG vs NCP130BMX105TCG |
NCP130AMX120TCG Frequently Asked Questions (FAQ)
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A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and ensure that the thermal pad is connected to a solid ground plane.
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To ensure reliable start-up, ensure that the input voltage is within the recommended range, and that the output capacitor is properly sized to handle the inrush current. Also, ensure that the feedback network is properly designed to provide a stable output voltage. A soft-start circuit can also be added to reduce the inrush current and ensure reliable start-up.
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For EMI filtering and shielding, use a common-mode choke and a differential-mode filter to reduce conducted emissions. Ensure that the PCB layout is designed to minimize radiated emissions, and use shielding techniques such as copper pours and metal cans to reduce radiated emissions. Also, ensure that the device is placed in a shielded area to reduce electromagnetic interference.
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To optimize the design for low standby power consumption, ensure that the device is in a low-power mode during standby, and that the output voltage is reduced to a minimum. Use a low-power mode controller, and ensure that the feedback network is designed to minimize power consumption. Also, consider using a low-power oscillator and a low-power voltage reference.
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For thermal design and heat sinking, ensure that the device is mounted on a heat sink with a thermal conductivity of at least 1 W/m-K. Use a thermal interface material with a thermal conductivity of at least 1 W/m-K, and ensure that the heat sink is properly attached to the device. Also, ensure that the PCB layout is designed to minimize thermal resistance, and that the device is placed in a well-ventilated area.