Part Details for N02L63W3AB25I by onsemi
Results Overview of N02L63W3AB25I by onsemi
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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N02L63W3AB25I Information
N02L63W3AB25I by onsemi is an SRAM.
SRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for N02L63W3AB25I
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
86124900
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Verical | SRAM Chip Async Single 3V 2M-bit 128K x 16 70ns 48-Pin BGA Tray RoHS: Compliant Min Qty: 140 Package Multiple: 1 Date Code: 0701 | Americas - 3103 |
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$2.2625 / $2.6875 | Buy Now |
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Rochester Electronics | IC SRAM 2MBIT 70NS 48BGA RoHS: Compliant Status: Obsolete Min Qty: 1 | 3103 |
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$1.8100 / $2.2600 | Buy Now |
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Rochester Electronics | IC SRAM 2MBIT 70NS 48BGA RoHS: Compliant Status: Obsolete Min Qty: 1 | 480 |
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$1.8100 / $2.2600 | Buy Now |
Part Details for N02L63W3AB25I
N02L63W3AB25I CAD Models
N02L63W3AB25I Part Data Attributes
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N02L63W3AB25I
onsemi
Buy Now
Datasheet
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Compare Parts:
N02L63W3AB25I
onsemi
128KX16 STANDARD SRAM, 70ns, PBGA48, 6 X 8 MM, GREEN, BGA-48
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ONSEMI | |
Part Package Code | BGA | |
Package Description | 6 X 8 MM, GREEN, BGA-48 | |
Pin Count | 48 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Factory Lead Time | 4 Weeks | |
Samacsys Manufacturer | onsemi | |
Access Time-Max | 70 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-PBGA-B48 | |
Length | 8 mm | |
Memory Density | 2097152 bit | |
Memory IC Type | STANDARD SRAM | |
Memory Width | 16 | |
Number of Functions | 1 | |
Number of Terminals | 48 | |
Number of Words | 131072 words | |
Number of Words Code | 128000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 128KX16 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA48,6X8,30 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.34 mm | |
Standby Current-Max | 0.00001 A | |
Standby Voltage-Min | 1.8 V | |
Supply Current-Max | 0.016 mA | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.3 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BALL | |
Terminal Pitch | 0.75 mm | |
Terminal Position | BOTTOM | |
Width | 6 mm |