Datasheets
MTFC32GAKAENA-4MIT by: Micron Technology Inc

Flash Card, 32GX8, PBGA100, 14 X 18 MM, 1.20 MM HEIGHT, GREEN, TBGA-100

Part Details for MTFC32GAKAENA-4MIT by Micron Technology Inc

Results Overview of MTFC32GAKAENA-4MIT by Micron Technology Inc

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

MTFC32GAKAENA-4MIT Information

MTFC32GAKAENA-4MIT by Micron Technology Inc is a Flash Memory.
Flash Memories are under the broader part category of Memory Components.

Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.

Price & Stock for MTFC32GAKAENA-4MIT

Part # Distributor Description Stock Price Buy
Vyrian Memory ICs 955
RFQ

Part Details for MTFC32GAKAENA-4MIT

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MTFC32GAKAENA-4MIT Part Data Attributes

MTFC32GAKAENA-4MIT Micron Technology Inc
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MTFC32GAKAENA-4MIT Micron Technology Inc Flash Card, 32GX8, PBGA100, 14 X 18 MM, 1.20 MM HEIGHT, GREEN, TBGA-100
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC
Package Description 14 X 18 MM, 1.20 MM HEIGHT, GREEN, TBGA-100
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
JESD-30 Code R-PBGA-B100
JESD-609 Code e1
Length 18 mm
Memory Density 274877906944 bit
Memory IC Type FLASH CARD
Memory Width 8
Number of Functions 1
Number of Terminals 100
Number of Words 34359738368 words
Number of Words Code 32000000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 32GX8
Package Body Material PLASTIC/EPOXY
Package Code TBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Programming Voltage 2.7 V
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 14 mm

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