Datasheets
MTD2955V by:

12A, 60V, 0.23ohm, P-CHANNEL, Si, POWER, MOSFET, CASE 369C-01, DPAK-3

Part Details for MTD2955V by onsemi

Results Overview of MTD2955V by onsemi

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Applications Energy and Power Systems Transportation and Logistics Renewable Energy Automotive

MTD2955V Information

MTD2955V by onsemi is a Power Field-Effect Transistor.
Power Field-Effect Transistors are under the broader part category of Transistors.

A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.

Part Details for MTD2955V

MTD2955V CAD Models

MTD2955V Part Data Attributes

MTD2955V onsemi
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MTD2955V onsemi 12A, 60V, 0.23ohm, P-CHANNEL, Si, POWER, MOSFET, CASE 369C-01, DPAK-3
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer ON SEMICONDUCTOR
Package Description CASE 369C-01, DPAK-3
Pin Count 3
Manufacturer Package Code CASE 369C-01
Reach Compliance Code not_compliant
ECCN Code EAR99
HTS Code 8541.29.00.95
Samacsys Manufacturer onsemi
Additional Feature AVALANCHE RATED
Avalanche Energy Rating (Eas) 216 mJ
Case Connection DRAIN
Configuration SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min 60 V
Drain Current-Max (ID) 12 A
Drain-source On Resistance-Max 0.23 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR
JESD-30 Code R-PSSO-G2
JESD-609 Code e0
Moisture Sensitivity Level 1
Number of Elements 1
Number of Terminals 2
Operating Mode ENHANCEMENT MODE
Operating Temperature-Max 175 °C
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Peak Reflow Temperature (Cel) 235
Polarity/Channel Type P-CHANNEL
Power Dissipation-Max (Abs) 60 W
Pulsed Drain Current-Max (IDM) 42 A
Qualification Status Not Qualified
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form GULL WING
Terminal Position SINGLE
Transistor Application SWITCHING
Transistor Element Material SILICON

Alternate Parts for MTD2955V

This table gives cross-reference parts and alternative options found for MTD2955V. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MTD2955V, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
MTD2955V1G onsemi Check for Price 12A, 60V, 0.23ohm, P-CHANNEL, Si, POWER, MOSFET, DPAK-3 MTD2955V vs MTD2955V1G
MTD2955V1 onsemi Check for Price TRANSISTOR 12 A, 60 V, 0.23 ohm, P-CHANNEL, Si, POWER, MOSFET, DPAK-3, FET General Purpose Power MTD2955V vs MTD2955V1
Part Number Manufacturer Composite Price Description Compare
MTD2955V Fairchild Semiconductor Corporation Check for Price Power Field-Effect Transistor, 12A I(D), 60V, 0.23ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, TO-252, DPAK-3 MTD2955V vs MTD2955V
MTD2955V-1 onsemi Check for Price 12A, 60V, 0.23ohm, P-CHANNEL, Si, POWER, MOSFET, CASE 369D-01, DPAK-3 MTD2955V vs MTD2955V-1
MTD2955VT4 onsemi Check for Price Power MOSFET 60 V, 12 A, P Channel DPAK, DPAK (SINGLE GAUGE) TO-252, 2500-REEL MTD2955V vs MTD2955VT4
MTD2955VT4G onsemi Check for Price 12A, 60V, 0.23ohm, P-CHANNEL, Si, POWER, MOSFET, LEAD FREE, CASE 369C-01, DPAK-3 MTD2955V vs MTD2955VT4G
2SJ549STL-E Renesas Electronics Corporation Check for Price Pch Single Power Mosfet -60V -12A 150Mohm LDPAK(S)-(1)/To-263, LDPAK(S)-(1), /Embossed Tape MTD2955V vs 2SJ549STL-E
2SJ549S-E Renesas Electronics Corporation Check for Price 12A, 60V, 0.23ohm, P-CHANNEL, Si, POWER, MOSFET, LDPAK-3 MTD2955V vs 2SJ549S-E
MTD2955V-1G onsemi Check for Price 12A, 60V, 0.23ohm, P-CHANNEL, Si, POWER, MOSFET, LEAD FREE, CASE 369D-01, DPAK-3 MTD2955V vs MTD2955V-1G

MTD2955V Related Parts

MTD2955V Frequently Asked Questions (FAQ)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the device is recommended. This helps to dissipate heat efficiently and reduce thermal resistance.

  • Ensure proper heat sinking, use a thermal interface material (TIM) between the device and heat sink, and follow the recommended PCB layout guidelines. Also, consider derating the device's power handling at high temperatures.

  • The SOA is typically defined by the device's voltage, current, and power ratings. For the MTD2955V, the SOA is limited by the maximum voltage rating (Vds) of 55V, maximum current rating (Id) of 2.5A, and maximum power rating (Pd) of 30W.

  • Use proper ESD handling and storage procedures, such as using anti-static bags, wrist straps, and mats. Also, ensure that the PCB design includes ESD protection components, such as TVS diodes or ESD protection arrays.

  • A gate drive circuit with a high current capability (e.g., 1A) and a fast rise time (e.g., 10ns) is recommended. The gate drive voltage should be between 10V and 15V, and the gate resistance should be minimized to reduce switching losses.

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