Part Details for MT8808APR1 by Microsemi Corporation
Results Overview of MT8808APR1 by Microsemi Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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MT8808APR1 Information
MT8808APR1 by Microsemi Corporation is a Multiplexer or Switch.
Multiplexers or Switches are under the broader part category of Signal Circuits.
A signal is an electronic means of transmitting information, either as an analog signal with continuous values or a digital signal with discrete values. Signals are used in various systems and networks. Read more about Signal Circuits on our Signal Circuits part category page.
Price & Stock for MT8808APR1
| Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Other Function Semiconductors | 628 |
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RFQ |
Part Details for MT8808APR1
MT8808APR1 CAD Models
MT8808APR1 Part Data Attributes
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MT8808APR1
Microsemi Corporation
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Datasheet
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MT8808APR1
Microsemi Corporation
Cross Point Switch, 1 Func, 8 Channel, CMOS, PQCC28, LEAD FREE, PLASTIC, MS-018AB, LCC-28
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Part Package Code | LCC | |
| Package Description | LEAD FREE, PLASTIC, MS-018AB, LCC-28 | |
| Pin Count | 28 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Microsemi Corporation | |
| Analog IC - Other Type | CROSS POINT SWITCH | |
| JESD-30 Code | S-PQCC-J28 | |
| JESD-609 Code | e3 | |
| Length | 11.505 mm | |
| Number of Channels | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Off-state Isolation-Nom | 95 dB | |
| On-state Resistance Match-Nom | 5 Ω | |
| On-state Resistance-Max (Ron) | 185 Ω | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Output | SEPARATE OUTPUT | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCJ | |
| Package Equivalence Code | LDCC28,.5SQ | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 4.57 mm | |
| Supply Voltage-Max (Vsup) | 13.2 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Switch-on Time-Max | 100 ns | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Width | 11.505 mm |
MT8808APR1 Frequently Asked Questions (FAQ)
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Microsemi provides a recommended PCB layout in the MT8808APR1 application note (document number 13034). It includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
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The MT8808APR1 requires a specific power-up sequence and configuration to operate correctly. Refer to the device's application note (document number 13034) for detailed information on power-up sequencing, voltage regulator configuration, and clock signal requirements.
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The MT8808APR1 has a maximum junction temperature of 150°C. To ensure reliable operation, it's essential to implement proper thermal management, such as using a heat sink, thermal interface material, and ensuring good airflow around the device. Refer to the device's thermal management application note (document number 13035) for more information.
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Microsemi provides a troubleshooting guide for the MT8808APR1 in the device's application note (document number 13034). It covers common issues, such as power-up problems, clock signal issues, and data transmission errors, along with recommended debugging techniques and tools.
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Yes, the MT8808APR1 is a high-frequency device and requires careful attention to electromagnetic interference (EMI) and radio-frequency interference (RFI) mitigation. Refer to the device's EMI and RFI application note (document number 13036) for guidelines on shielding, filtering, and layout techniques to minimize EMI and RFI.