Part Details for MT48LC8M16A2B4-6AIT:L by Micron Technology Inc
Results Overview of MT48LC8M16A2B4-6AIT:L by Micron Technology Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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MT48LC8M16A2B4-6AIT:L Information
MT48LC8M16A2B4-6AIT:L by Micron Technology Inc is a DRAM.
DRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for MT48LC8M16A2B4-6AIT:L
| Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Memory ICs | 1465 |
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RFQ |
Part Details for MT48LC8M16A2B4-6AIT:L
MT48LC8M16A2B4-6AIT:L CAD Models
MT48LC8M16A2B4-6AIT:L Part Data Attributes
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MT48LC8M16A2B4-6AIT:L
Micron Technology Inc
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MT48LC8M16A2B4-6AIT:L
Micron Technology Inc
Synchronous DRAM, 8MX16, 5.4ns, CMOS, PBGA54, 8 X 8 MM, LEAD FREE, VFBGA-54
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICRON TECHNOLOGY INC | |
| Part Package Code | BGA | |
| Package Description | VFBGA-54 | |
| Pin Count | 54 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.02 | |
| Access Mode | FOUR BANK PAGE BURST | |
| Access Time-Max | 5.4 ns | |
| Additional Feature | AUTO/SELF REFRESH | |
| Clock Frequency-Max (fCLK) | 167 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 1,2,4,8 | |
| JESD-30 Code | S-PBGA-B54 | |
| JESD-609 Code | e1 | |
| Length | 8 mm | |
| Memory Density | 134217728 bit | |
| Memory IC Type | SYNCHRONOUS DRAM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 54 | |
| Number of Words | 8388608 words | |
| Number of Words Code | 8000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 8MX16 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Equivalence Code | BGA54,9X9,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Refresh Cycles | 4096 | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 1 mm | |
| Self Refresh | YES | |
| Sequential Burst Length | 1,2,4,8,FP | |
| Standby Current-Max | 0.0025 A | |
| Supply Current-Max | 0.1 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 3 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 8 mm |
MT48LC8M16A2B4-6AIT:L Frequently Asked Questions (FAQ)
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The maximum operating temperature range for this DDR3L SDRAM is 0°C to 95°C.
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To ensure signal integrity, it is recommended to use a signal integrity analysis tool to simulate the signal behavior and optimize the PCB design. Additionally, following the JEDEC specifications for DDR3L SDRAM and using a well-designed PCB layout can help minimize signal degradation.
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The recommended refresh rate for this DDR3L SDRAM is 3.9 μs at 1.35V and 2.5 μs at 1.5V.
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No, this DDR3L SDRAM is designed to operate at a voltage supply of 1.35V ± 0.0675V. Using it with a different voltage supply may affect its performance and reliability.
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Error handling and retries should be implemented in the system design to handle errors that may occur during data transfer. This can include implementing error correction codes, retry mechanisms, and error detection and correction algorithms.