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Part Details for MT41J128M16JT-125:K by Micron Technology Inc
Results Overview of MT41J128M16JT-125:K by Micron Technology Inc
- Distributor Offerings: (20 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
MT41J128M16JT-125:K Information
MT41J128M16JT-125:K by Micron Technology Inc is a DRAM.
DRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for MT41J128M16JT-125:K
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
80AH8004
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Newark | Dram, 128M X 16Bit, 0 To 95Deg C, Dram Type:Ddr3, Memory Configuration:128M X 16Bit, Clock Frequency Max:800Mhz, Ic Case/Package:Fbga, No. Of Pins:96Pins, Supply Voltage Nom:1.5V, Ic Mounting:Surface Mount, Product Range:- Rohs Compliant: Yes |Micron MT41J128M16JT-125:K RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 0 Container: Bulk | 2982 |
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$1.7200 | Buy Now |
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DISTI #
557-MT41J128M16JT-125:K-ND
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DigiKey | IC DRAM 2GBIT PARALLEL 96FBGA Min Qty: 1 Lead time: 10 Weeks Container: Bulk | Temporarily Out of Stock |
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$2.2827 / $2.8900 | Buy Now |
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DISTI #
MT41J128M16JT-125:K
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Avnet Americas | DRAM Chip DDR3 SDRAM 2G-Bit 128Mx16 1.5V 96-Pin F-BGA - Trays (Alt: MT41J128M16JT-125:K) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 12 Weeks, 0 Days Container: Tray | 11518 |
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$2.0352 / $2.0776 | Buy Now |
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DISTI #
80AH8004
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Avnet Americas | DRAM Chip DDR3 SDRAM 2G-Bit 128Mx16 1.5V 96-Pin F-BGA - Bulk (Alt: 80AH8004) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 14 Weeks, 1 Days Container: Bulk | 2982 Partner Stock |
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$4.0700 | Buy Now |
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DISTI #
340-135528-TRAY
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Mouser Electronics | DRAM DDR3 2Gbit 16 96/144 FBGA 1 CT RoHS: Compliant | 5157 |
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$2.5100 / $3.4500 | Buy Now |
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DISTI #
E54:1762_04105175
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Arrow Electronics | DRAM Chip DDR3 SDRAM 2Gbit 128Mx16 1.5V 96-Pin FBGA Tray RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 10 Weeks Date Code: 2502 | Europe - 42057 |
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$2.8630 | Buy Now |
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DISTI #
V36:1790_07220135
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Arrow Electronics | DRAM Chip DDR3 SDRAM 2Gbit 128Mx16 1.5V 96-Pin FBGA Tray RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 12 Weeks Date Code: 2346 | Americas - 451 |
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$2.0570 / $2.8630 | Buy Now |
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DISTI #
87661415
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Verical | DRAM Chip DDR3 SDRAM 2Gbit 128Mx16 1.5V 96-Pin FBGA Tray RoHS: Compliant Min Qty: 3 Package Multiple: 1 Date Code: 2502 | Americas - 42057 |
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$2.8630 | Buy Now |
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DISTI #
76442184
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Verical | DRAM Chip DDR3 SDRAM 2Gbit 128Mx16 1.5V 96-Pin FBGA Tray RoHS: Compliant Min Qty: 4 Package Multiple: 1 Date Code: 2346 | Americas - 451 |
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$2.0570 / $2.8630 | Buy Now |
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Quest Components | 128MX16 DDR DRAM, PBGA96 | 65 |
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$4.0365 / $9.3150 | Buy Now |
Part Details for MT41J128M16JT-125:K
MT41J128M16JT-125:K CAD Models
MT41J128M16JT-125:K Part Data Attributes
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MT41J128M16JT-125:K
Micron Technology Inc
Buy Now
Datasheet
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Compare Parts:
MT41J128M16JT-125:K
Micron Technology Inc
DDR DRAM, 128MX16, 0.225ns, CMOS, PBGA96, 8 X 14 MM, LEAD FREE, FBGA-96
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICRON TECHNOLOGY INC | |
| Part Package Code | BGA | |
| Package Description | 8 X 14 MM, LEAD FREE, FBGA-96 | |
| Pin Count | 96 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.36 | |
| Factory Lead Time | 14 Weeks, 1 Day | |
| Samacsys Manufacturer | Micron | |
| Access Mode | MULTI BANK PAGE BURST | |
| Access Time-Max | 0.225 ns | |
| Additional Feature | AUTO/SELF REFRESH | |
| Clock Frequency-Max (fCLK) | 800 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 8 | |
| JESD-30 Code | R-PBGA-B96 | |
| JESD-609 Code | e1 | |
| Length | 14 mm | |
| Memory Density | 2147483648 bit | |
| Memory IC Type | DDR3 DRAM | |
| Memory Width | 16 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 96 | |
| Number of Words | 134217728 words | |
| Number of Words Code | 128000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 128MX16 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA96,9X16,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Refresh Cycles | 8192 | |
| Seated Height-Max | 1.2 mm | |
| Self Refresh | YES | |
| Sequential Burst Length | 8 | |
| Standby Current-Max | 0.012 A | |
| Supply Current-Max | 0.202 mA | |
| Supply Voltage-Max (Vsup) | 1.575 V | |
| Supply Voltage-Min (Vsup) | 1.425 V | |
| Supply Voltage-Nom (Vsup) | 1.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 8 mm |
MT41J128M16JT-125:K Frequently Asked Questions (FAQ)
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The maximum operating temperature range for this module is 0°C to 95°C.
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To ensure signal integrity, use a controlled impedance PCB, keep the signal traces short, and use a termination scheme such as ODT (On-Die Termination) or a discrete resistor.
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The recommended refresh rate is 4K refresh cycles every 64ms (tREFI) at a temperature range of 0°C to 95°C.
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No, this module is designed to operate at a voltage supply of 1.2V (VDD) and 1.2V (VDDQ). Using a different voltage supply may damage the module or affect its performance.
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The ZQ calibration is an internal process that occurs during power-up. No external calibration is required. The module will automatically calibrate its ZQ (output impedance) during the power-up sequence.