Part Details for MSP430F6769IPEUR by Texas Instruments
Results Overview of MSP430F6769IPEUR by Texas Instruments
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Environmental Monitoring
Internet of Things (IoT)
Industrial Automation
Smart Cities
Agriculture Technology
Renewable Energy
Robotics and Drones
MSP430F6769IPEUR Information
MSP430F6769IPEUR by Texas Instruments is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for MSP430F6769IPEUR
| Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Peripheral ICs | 591 |
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RFQ |
Part Details for MSP430F6769IPEUR
MSP430F6769IPEUR CAD Models
MSP430F6769IPEUR Part Data Attributes
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MSP430F6769IPEUR
Texas Instruments
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Datasheet
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MSP430F6769IPEUR
Texas Instruments
Polyphase Metering SoC with 6 Sigma-Delta ADCs, LCD, Real-Time Clock, AES, 512KB Flash, 32KB RAM 128-LQFP -40 to 85
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
| Part Package Code | QFP | |
| Package Description | LFQFP, QFP128,.63X.87,20 | |
| Pin Count | 128 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.31.00.01 | |
| Bit Size | 16 | |
| Bus Compatibility | I2C; SPI; UART | |
| CPU Family | MSP430 | |
| Clock Frequency-Max | 25 MHz | |
| External Data Bus Width | ||
| JESD-30 Code | R-PQFP-G128 | |
| JESD-609 Code | e4 | |
| Length | 20 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 128 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP128,.63X.87,20 | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 32768 | |
| ROM (words) | 524288 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.6 mm | |
| Speed | 25 MHz | |
| Supply Current-Max | 11.75 mA | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 1.8 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | NICKEL PALLADIUM GOLD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 14 mm | |
| uPs/uCs/Peripheral ICs Type | SoC |