Part Details for MSKD60-12 by Microsemi Corporation
Results Overview of MSKD60-12 by Microsemi Corporation
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- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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MSKD60-12 Information
MSKD60-12 by Microsemi Corporation is a Rectifier Diode.
Rectifier Diodes are under the broader part category of Diodes.
A diode is a electrical part that can control the direction in which the current flows in a device. Consider factors like voltage drop, current capacity, reverse voltage, and operating frequency when selecting a diode. Read more about Diodes on our Diodes part category page.
Part Details for MSKD60-12
MSKD60-12 CAD Models
MSKD60-12 Part Data Attributes
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MSKD60-12
Microsemi Corporation
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Datasheet
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MSKD60-12
Microsemi Corporation
Rectifier Diode, 1 Phase, 2 Element, 60A, 1200V V(RRM), Silicon, CASE D1, 3 PIN
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | CASE D1, 3 PIN | |
| Pin Count | 3 | |
| Manufacturer Package Code | CASE D1 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.10.00.80 | |
| Samacsys Manufacturer | Microsemi Corporation | |
| Application | GENERAL PURPOSE | |
| Case Connection | ISOLATED | |
| Configuration | COMMON CATHODE, 2 ELEMENTS | |
| Diode Element Material | SILICON | |
| Diode Type | RECTIFIER DIODE | |
| Forward Voltage-Max (VF) | 1.3 V | |
| JESD-30 Code | R-XUFM-X3 | |
| Non-rep Pk Forward Current-Max | 1150 A | |
| Number of Elements | 2 | |
| Number of Phases | 1 | |
| Number of Terminals | 3 | |
| Operating Temperature-Max | 150 °C | |
| Operating Temperature-Min | -40 °C | |
| Output Current-Max | 60 A | |
| Package Body Material | UNSPECIFIED | |
| Package Shape | RECTANGULAR | |
| Package Style | FLANGE MOUNT | |
| Qualification Status | Not Qualified | |
| Reference Standard | UL RECOGNIZED | |
| Rep Pk Reverse Voltage-Max | 1200 V | |
| Surface Mount | NO | |
| Terminal Form | UNSPECIFIED | |
| Terminal Position | UPPER |
MSKD60-12 Frequently Asked Questions (FAQ)
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Microsemi recommends a 4-layer PCB with a dedicated power plane, and thermal vias under the device to dissipate heat. A thermal pad on the bottom of the device should be connected to a heat sink or a thermal management system.
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Microsemi recommends following the recommended operating temperature range (-40°C to 125°C) and using a heat sink or thermal management system to keep the junction temperature below 150°C. Additionally, ensure proper PCB design, layout, and thermal management to minimize thermal resistance.
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The MSKD60-12 has built-in ESD protection, but handling precautions are still necessary. Handle the device by the body, avoid touching the pins, and use an ESD wrist strap or mat. Store the device in an anti-static bag or container.
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The MSKD60-12 is not specifically designed for radiation-hardened applications. However, Microsemi offers radiation-hardened versions of similar devices. Contact Microsemi for more information on radiation-hardened options.
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Microsemi recommends following the JEDEC J-STD-020 standard for soldering and rework. The recommended peak reflow temperature is 260°C, and the recommended soldering time is 10-30 seconds.