Part Details for MSKD120-16 by Microsemi Corporation
Results Overview of MSKD120-16 by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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MSKD120-16 Information
MSKD120-16 by Microsemi Corporation is a Rectifier Diode.
Rectifier Diodes are under the broader part category of Diodes.
A diode is a electrical part that can control the direction in which the current flows in a device. Consider factors like voltage drop, current capacity, reverse voltage, and operating frequency when selecting a diode. Read more about Diodes on our Diodes part category page.
Part Details for MSKD120-16
MSKD120-16 CAD Models
MSKD120-16 Part Data Attributes
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MSKD120-16
Microsemi Corporation
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Datasheet
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MSKD120-16
Microsemi Corporation
Rectifier Diode, 1 Phase, 2 Element, 120A, 1600V V(RRM), Silicon, CASE D1, 3 PIN
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | CASE D1, 3 PIN | |
| Pin Count | 3 | |
| Manufacturer Package Code | CASE D1 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.10.00.80 | |
| Samacsys Manufacturer | Microsemi Corporation | |
| Application | GENERAL PURPOSE | |
| Case Connection | ISOLATED | |
| Configuration | COMMON CATHODE, 2 ELEMENTS | |
| Diode Element Material | SILICON | |
| Diode Type | RECTIFIER DIODE | |
| JESD-30 Code | R-XUFM-X3 | |
| JESD-609 Code | e0 | |
| Non-rep Pk Forward Current-Max | 2800 A | |
| Number of Elements | 2 | |
| Number of Phases | 1 | |
| Number of Terminals | 3 | |
| Operating Temperature-Max | 150 °C | |
| Operating Temperature-Min | -40 °C | |
| Output Current-Max | 120 A | |
| Package Body Material | UNSPECIFIED | |
| Package Shape | RECTANGULAR | |
| Package Style | FLANGE MOUNT | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Reference Standard | UL RECOGNIZED | |
| Rep Pk Reverse Voltage-Max | 1600 V | |
| Surface Mount | NO | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | UNSPECIFIED | |
| Terminal Position | UPPER | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Alternate Parts for MSKD120-16
This table gives cross-reference parts and alternative options found for MSKD120-16. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MSKD120-16, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| MD120K16D1 | Yangzhou Yangjie Electronics Co Ltd | Check for Price | Rectifier Diode, | MSKD120-16 vs MD120K16D1 |
MSKD120-16 Frequently Asked Questions (FAQ)
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Microsemi recommends a 4-layer PCB with a solid ground plane, and thermal vias under the device to dissipate heat. A thermal pad on the bottom of the device should be connected to a heat sink or a thermal interface material.
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To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, use a heat sink, and implement thermal management techniques such as thermal interface materials and airflow management.
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The MSKD120-16 is a sensitive device and requires proper ESD protection during handling and assembly. It's recommended to follow standard ESD handling procedures, use ESD-safe materials, and implement ESD protection devices in the circuit design.
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The MSKD120-16 is not specifically designed or tested for radiation-hardened applications. However, Microsemi offers radiation-hardened versions of similar devices, such as the QP120-16, which can be used in such applications.
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Microsemi recommends following the testing and validation procedures outlined in the datasheet, including electrical characterization, environmental testing, and reliability testing. Additionally, it's essential to perform application-specific testing and validation to ensure the device meets the required specifications.