Part Details for MSCSM170AM058CD3AG by Microchip Technology Inc
Results Overview of MSCSM170AM058CD3AG by Microchip Technology Inc
- Distributor Offerings: (15 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Robotics and Drones
MSCSM170AM058CD3AG Information
MSCSM170AM058CD3AG by Microchip Technology Inc is a Power Field-Effect Transistor.
Power Field-Effect Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for MSCSM170AM058CD3AG
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
62AJ4666
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Newark | Pm-Mosfet-Sic-Sbd-D3 Rohs Compliant: Yes |Microchip MSCSM170AM058CD3AG RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$665.2600 / $712.7800 | Buy Now |
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DISTI #
150-MSCSM170AM058CD3AG-ND
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DigiKey | MOSFET 2N-CH 1700V 353A Min Qty: 1 Lead time: 20 Weeks Container: Tube |
8 In Stock |
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$742.4800 | Buy Now |
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DISTI #
MSCSM170AM058CD3AG
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Avnet Americas | MOSFET Power Module Phase Leg 1700V 353A - Bulk (Alt: MSCSM170AM058CD3AG) RoHS: Not Compliant Min Qty: 1 Package Multiple: 1 Lead time: 20 Weeks, 0 Days Container: Bulk | 0 |
|
$703.8679 / $775.1475 | Buy Now |
|
DISTI #
579-CSM170AM058CD3AG
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Mouser Electronics | Discrete Semiconductor Modules PM-MOSFET-SIC-SBD-D3 RoHS: Compliant | 1 |
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$742.4700 | Buy Now |
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DISTI #
V99:2348_26124346
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Arrow Electronics | Trans MOSFET N-CH SiC 1.7KV 353A 11-Pin Min Qty: 1 Package Multiple: 1 Lead time: 20 Weeks Date Code: 2415 | Americas - 1 |
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$753.8400 | Buy Now |
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DISTI #
MSCSM170AM058CD3AG
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Microchip Technology Inc | CC7150, Projected EOL: 2044-09-03 COO: Philippines ECCN: EAR99 Lead time: 20 Weeks, 0 Days |
0 Alternates Available |
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$564.2800 / $712.7800 | Buy Now |
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|
Onlinecomponents.com | RoHS: Compliant | 3 Factory Stock |
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$722.3000 / $761.5100 | Buy Now |
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DISTI #
77263692
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Verical | Trans MOSFET N-CH SiC 1.7KV 353A 11-Pin Min Qty: 1 Package Multiple: 1 | Americas - 10 |
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$990.0000 | Buy Now |
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DISTI #
58866484
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Verical | Trans MOSFET N-CH SiC 1.7KV 353A 11-Pin Min Qty: 1 Package Multiple: 1 | Americas - 3 |
|
$1,076.8828 | Buy Now |
|
DISTI #
82391815
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Verical | Trans MOSFET N-CH SiC 1.7KV 353A 11-Pin Min Qty: 1 Package Multiple: 1 Date Code: 2415 | Americas - 1 |
|
$753.8400 | Buy Now |
Part Details for MSCSM170AM058CD3AG
MSCSM170AM058CD3AG CAD Models
MSCSM170AM058CD3AG Part Data Attributes
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MSCSM170AM058CD3AG
Microchip Technology Inc
Buy Now
Datasheet
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Compare Parts:
MSCSM170AM058CD3AG
Microchip Technology Inc
Power Field-Effect Transistor
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Package Description | MODULE-7 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| Factory Lead Time | 20 Weeks | |
| Case Connection | ISOLATED | |
| Configuration | SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE | |
| DS Breakdown Voltage-Min | 1700 V | |
| Drain Current-Max (ID) | 353 A | |
| Drain-source On Resistance-Max | 0.0075 Ω | |
| FET Technology | METAL-OXIDE SEMICONDUCTOR | |
| Feedback Cap-Max (Crss) | 60 pF | |
| JESD-30 Code | R-XUFM-X7 | |
| Number of Elements | 2 | |
| Number of Terminals | 7 | |
| Operating Mode | ENHANCEMENT MODE | |
| Operating Temperature-Max | 175 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Shape | RECTANGULAR | |
| Package Style | FLANGE MOUNT | |
| Polarity/Channel Type | N-CHANNEL | |
| Pulsed Drain Current-Max (IDM) | 700 A | |
| Surface Mount | NO | |
| Terminal Form | UNSPECIFIED | |
| Terminal Position | UPPER | |
| Transistor Application | SWITCHING | |
| Transistor Element Material | SILICON CARBIDE |
MSCSM170AM058CD3AG Frequently Asked Questions (FAQ)
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Microchip provides a recommended PCB layout in the 'Thermal Management' section of the datasheet, but for optimal performance, it's recommended to use a 4-layer PCB with a solid ground plane, and to place thermal vias under the package to dissipate heat efficiently.
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To ensure reliable operation in high-vibration environments, it's recommended to use a robust PCB design, secure the device with a suitable mounting method, and consider using a vibration-dampening material or potting compound to reduce mechanical stress on the device.
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Microchip recommends following the JEDEC J-STD-020D.1 standard for soldering conditions, which specifies a peak temperature of 260°C (500°F) and a dwell time of 30 seconds. It's also recommended to use a solder with a melting point above 217°C (423°F) to ensure reliable joints.
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To prevent ESD damage, it's recommended to handle the device in an ESD-protected environment, use ESD-protective packaging, and follow proper grounding procedures during assembly. Additionally, consider using ESD-protection devices or diodes on the PCB to protect the device from ESD events.
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Operating the device beyond the recommended operating conditions can lead to reduced reliability, decreased performance, and potentially even device failure. It's recommended to operate the device within the specified temperature, voltage, and current ranges to ensure reliable operation and to avoid voiding the warranty.