Part Details for MSC8152SAG1000B by NXP Semiconductors
Results Overview of MSC8152SAG1000B by NXP Semiconductors
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- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
MSC8152SAG1000B Information
MSC8152SAG1000B by NXP Semiconductors is a Microprocessor.
Microprocessors are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Part Details for MSC8152SAG1000B
MSC8152SAG1000B CAD Models
MSC8152SAG1000B Part Data Attributes
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MSC8152SAG1000B
NXP Semiconductors
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MSC8152SAG1000B
NXP Semiconductors
RISC PROCESSOR
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | 29 X 29 MM, LEAD FREE, PLASTIC, FCBGA-783 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.1 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 16 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| External Data Bus Width | 64 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B783 | |
| JESD-609 Code | e1 | |
| Length | 29 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 783 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Equivalence Code | BGA783,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Peak Reflow Temperature (Cel) | 245 | |
| Qualification Status | Not Qualified | |
| RAM (words) | 8192 | |
| Seated Height-Max | 3.94 mm | |
| Speed | 1000 MHz | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 0.97 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 29 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |