Datasheets
MPLAD30KP51CAE3 by:
Microsemi Corporation

Trans Voltage Suppressor Diode, 30000W, 51V V(RWM), Bidirectional, 1 Element, Silicon, ROHS COMPLIANT, PLASTIC PACKAGE-1

Part Details for MPLAD30KP51CAE3 by Microsemi Corporation

Results Overview of MPLAD30KP51CAE3 by Microsemi Corporation

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MPLAD30KP51CAE3 Information

MPLAD30KP51CAE3 by Microsemi Corporation is a Transient Suppressor.
Transient Suppressors are under the broader part category of Diodes.

A diode is a electrical part that can control the direction in which the current flows in a device. Consider factors like voltage drop, current capacity, reverse voltage, and operating frequency when selecting a diode. Read more about Diodes on our Diodes part category page.

Price & Stock for MPLAD30KP51CAE3

Part # Distributor Description Stock Price Buy
Vyrian Diodes 332
RFQ

Part Details for MPLAD30KP51CAE3

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MPLAD30KP51CAE3 Part Data Attributes

MPLAD30KP51CAE3 Microsemi Corporation
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MPLAD30KP51CAE3 Microsemi Corporation Trans Voltage Suppressor Diode, 30000W, 51V V(RWM), Bidirectional, 1 Element, Silicon, ROHS COMPLIANT, PLASTIC PACKAGE-1
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer MICROSEMI CORP
Package Description S-PSSO-G1
Pin Count 1
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8541.10.00.50
Schedule B Code 8541.10.00.50
Category CO2 Kg 8.54
Compliance Temperature Grade Military: -55C to +150C
EU RoHS Version RoHS 2 (2011/65/EU)
Candidate List Date 2018-06-27
Conflict Mineral Status DRC Conflict Free
Conflict Mineral Status Source CMRT V5.10
Additional Feature HIGH RELIABILITY
Breakdown Voltage-Max 62.7 V
Breakdown Voltage-Min 56.7 V
Breakdown Voltage-Nom 59.7 V
Case Connection CATHODE
Clamping Voltage-Max 82.4 V
Configuration SINGLE
Diode Element Material SILICON
Diode Type TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 Code S-PSSO-G1
JESD-609 Code e3
Moisture Sensitivity Level 1
Non-rep Peak Rev Power Dis-Max 30000 W
Number of Elements 1
Number of Terminals 1
Operating Temperature-Max 150 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY
Package Shape SQUARE
Package Style SMALL OUTLINE
Polarity BIDIRECTIONAL
Power Dissipation-Max 2.5 W
Qualification Status Not Qualified
Reference Standard MIL-19500
Rep Pk Reverse Voltage-Max 51 V
Surface Mount YES
Technology AVALANCHE
Terminal Finish MATTE TIN
Terminal Form GULL WING
Terminal Position SINGLE

Alternate Parts for MPLAD30KP51CAE3

This table gives cross-reference parts and alternative options found for MPLAD30KP51CAE3. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MPLAD30KP51CAE3, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
MPLAD30KP51CA/TR Microchip Technology Inc $44.7741 Trans Voltage Suppressor Diode, 30000W, 51V V(RWM), Bidirectional, 1 Element, Silicon MPLAD30KP51CAE3 vs MPLAD30KP51CA/TR
Part Number Manufacturer Composite Price Description Compare
MPLAD30KP51CA Microchip Technology Inc $45.0233 Trans Voltage Suppressor Diode, 30000W, 51V V(RWM), Bidirectional, 1 Element, Silicon MPLAD30KP51CAE3 vs MPLAD30KP51CA
MPLAD30KP51CAE3/TR Microchip Technology Inc $45.0477 Trans Voltage Suppressor Diode, 30000W, 51V V(RWM), Bidirectional, 1 Element, Silicon MPLAD30KP51CAE3 vs MPLAD30KP51CAE3/TR
MPLAD30KP51CA Microsemi Corporation Check for Price Trans Voltage Suppressor Diode, 30000W, 51V V(RWM), Bidirectional, 1 Element, Silicon, PLASTIC PACKAGE-1 MPLAD30KP51CAE3 vs MPLAD30KP51CA

MPLAD30KP51CAE3 Related Parts

MPLAD30KP51CAE3 Frequently Asked Questions (FAQ)

  • Microsemi recommends a PCB layout with a solid ground plane, short and wide traces for power and ground, and a decoupling capacitor (e.g., 10nF) between VCC and GND to minimize noise and ensure reliable operation.

  • The device has a thermal pad on the bottom, which should be connected to a thermal plane on the PCB. Ensure good thermal conductivity by using a thermal interface material (e.g., thermal tape or thermal grease) and a heat sink if necessary. Keep the ambient temperature below 85°C for reliable operation.

  • The input pins are ESD-protected, but it's recommended to limit the voltage to ±10V to prevent damage. Exceeding this voltage may cause permanent damage or affect the device's reliability.

  • The MPLAD30KP51CAE3 is a radiation-hardened device, but it's essential to follow the recommended radiation guidelines and testing procedures to ensure the device's performance and reliability in such environments.

  • Follow the recommended soldering profile and use a solder with a melting point above 217°C. Ensure the device is properly aligned and seated on the PCB, and use a solder mask to prevent bridging between pins.

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