Part Details for MPL4700-206 by Microsemi Corporation
Results Overview of MPL4700-206 by Microsemi Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (4 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Smart Cities
MPL4700-206 Information
MPL4700-206 by Microsemi Corporation is a PIN Diode.
PIN Diodes are under the broader part category of Diodes.
A diode is a electrical part that can control the direction in which the current flows in a device. Consider factors like voltage drop, current capacity, reverse voltage, and operating frequency when selecting a diode. Read more about Diodes on our Diodes part category page.
Price & Stock for MPL4700-206
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
MPL4700-206
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Richardson RFPD | RF PIN DIODE RoHS: Not Compliant Min Qty: 500 | 133 |
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$5.0700 | Buy Now |
Part Details for MPL4700-206
MPL4700-206 CAD Models
MPL4700-206 Part Data Attributes
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MPL4700-206
Microsemi Corporation
Buy Now
Datasheet
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Compare Parts:
MPL4700-206
Microsemi Corporation
Pin Diode, 25V V(BR), Silicon, ROHS COMPLIANT, 206, 2 PIN
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | ROHS COMPLIANT, 206, 2 PIN | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.10.00.80 | |
| Breakdown Voltage-Min | 25 V | |
| Configuration | SINGLE | |
| Diode Capacitance-Max | 0.15 pF | |
| Diode Element Material | SILICON | |
| Diode Forward Resistance-Max | 2 Ω | |
| Diode Res Test Current | 10 mA | |
| Diode Type | PIN DIODE | |
| Frequency Band | ULTRA HIGH FREQUENCY TO X BAND | |
| JESD-30 Code | R-XBCC-N2 | |
| JESD-609 Code | e4 | |
| Minority Carrier Lifetime-Nom | 0.02 µs | |
| Number of Elements | 1 | |
| Number of Terminals | 2 | |
| Operating Temperature-Max | 150 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Shape | RECTANGULAR | |
| Package Style | CHIP CARRIER | |
| Surface Mount | YES | |
| Technology | POSITIVE-INTRINSIC-NEGATIVE | |
| Terminal Finish | GOLD | |
| Terminal Form | NO LEAD | |
| Terminal Position | BOTTOM |
Alternate Parts for MPL4700-206
This table gives cross-reference parts and alternative options found for MPL4700-206. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MPL4700-206, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| MPL4700-206-HS | Microsemi Corporation | Check for Price | Pin Diode, 25V V(BR), Silicon, ROHS COMPLIANT, 206, 2 PIN | MPL4700-206 vs MPL4700-206-HS |
MPL4700-206 Frequently Asked Questions (FAQ)
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Microsemi recommends a 4-layer PCB with a solid ground plane, and thermal vias under the device to dissipate heat. A thermal pad on the bottom of the package should be connected to a heat sink or a thermal interface material.
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Implement a robust thermal management system, ensure good airflow, and consider using a heat sink or thermal interface material. Also, follow the recommended operating conditions and derating guidelines in the datasheet.
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Use low-ESR capacitors with a minimum capacitance of 10uF for input and output filtering. The capacitors should be placed close to the device and connected to the correct pins (VIN, VOUT, and GND).
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Use a multimeter to measure input and output voltages, and check for proper connections and component values. Verify the PCB layout and thermal management. Consult the datasheet and application notes for troubleshooting guidelines.
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Yes, use a shielded enclosure, and ensure good PCB layout practices, such as separating analog and digital grounds, and using a common mode choke or ferrite bead on the input lines.