Part Details for MPC859DSLCZP66A by Freescale Semiconductor
Results Overview of MPC859DSLCZP66A by Freescale Semiconductor
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MPC859DSLCZP66A Information
MPC859DSLCZP66A by Freescale Semiconductor is a Microprocessor.
Microprocessors are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Part Details for MPC859DSLCZP66A
MPC859DSLCZP66A CAD Models
MPC859DSLCZP66A Part Data Attributes
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MPC859DSLCZP66A
Freescale Semiconductor
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Datasheet
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MPC859DSLCZP66A
Freescale Semiconductor
32-BIT, 66MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
Part Package Code | BGA | |
Package Description | PLASTIC, BGA-357 | |
Pin Count | 357 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Address Bus Width | 32 | |
Bit Size | 32 | |
Boundary Scan | YES | |
External Data Bus Width | 32 | |
Format | FIXED POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-PBGA-B357 | |
JESD-609 Code | e0 | |
Length | 25 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 357 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA357,19X19,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 220 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.52 mm | |
Speed | 66 MHz | |
Supply Voltage-Max | 1.9 V | |
Supply Voltage-Min | 1.7 V | |
Supply Voltage-Nom | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 25 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |